Semiconductor Device with Transparent Silicone Adhesive for Blue-Violet Laser
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Solution Overview
Problem
Conventional semiconductor devices with epoxy resin sealing degrade when exposed to blue-violet lasers, leading to reduced transmittance and durability, and are prone to foreign substance adherence due to exposed device elements.
Innovation Solution
A semiconductor device with a semiconductor substrate and optically transparent substrate attached using a transparent silicone adhesive layer, covered by a protection layer to prevent exposure and degradation, ensuring the device element is not directly exposed to the outside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transparent epoxy resin is used for sealing the device element, then the device is protected from foreign substances, but the resin degrades when exposed to blue-violet laser causing reduced transmittance and durability
Solution Approach 1:
The patent removes the transparent epoxy resin sealing layer from the device structure. Instead of sealing the device element with degradable resin, the invention exposes the device element directly while using alternative protective measures that do not involve laser-sensitive organic materials, thereby eliminating the degradation problem caused by blue-violet laser exposure.
Solution Approach 2:
The invention changes the material parameter of the sealing structure from transparent epoxy resin to an alternative configuration that does not include laser-sensitive organic materials. This parameter change in material composition eliminates the chemical degradation reaction that occurs when epoxy resin is exposed to blue-violet laser wavelengths.
2Object-affected harmful factors
If the device element is exposed to outside without sealing resin, then resin degradation is avoided, but foreign substances adhere to the device element causing reduced reliability and yield
Solution Approach 1:
The patent introduces a reflective film as an intermediary layer between the device element and the external environment. This reflective film serves as a barrier that prevents foreign substances from directly adhering to the device element while allowing the device to operate without laser-degradable sealing resin, thus mediating between protection needs and laser exposure constraints.
3Reliability
If transparent epoxy resin is used for sealing, then the device element is protected, but the resin yellows and loses transparency when exposed to blue-violet laser
Solution Approach 1:
The invention extracts and removes the transparent epoxy resin sealing layer from the device structure. By eliminating the resin completely, the problem of yellowing and transmittance loss under blue-violet laser exposure is resolved, as there is no resin material left to undergo photodegradation and color change.
Solution Approach 2:
The invention converts the harmful effect of laser exposure on resin into a design opportunity by recognizing that removing the resin entirely allows the device to operate in a laser environment without degradation concerns. The absence of resin becomes beneficial by eliminating the transmittance loss problem that would otherwise occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents resin degradation and foreign substance adherence, enhancing the reliability and yield of semiconductor devices by using transparent silicone for the adhesive layer and an optically transparent substrate to maintain intermolecular bond stability and prevent oxidation.
Implementation Method 1
attached to the front surface of the semiconductor substrate with an adhesive layer being interposed therebetween, wherein the adhesive layer contains transparent silicone
Implementation Method 2
a device element converting a blue-violet laser into an electric signal
Implementation Method 3
the device element is covered by the optically transparent substrate
Implementation Method 4
preventing oxidation
Data Source
AI summary
The invention is directed to providing a semiconductor device receiving a blue-violet laser, of which the reliability and yield are enhanced. A device element converting a blue-violet laser into an electric signal is formed on a front surface of a semiconductor substrate. An optically transparent substrate is attached to the front surface of the semiconductor substrate with an adhesive layer being interposed therebetween. The adhesive layer contains transparent silicone. Since the front surface of the device element is covered by the optically transparent substrate, foreign substances are prevented from adhering to the front surface of the device element. Furthermore, the adhesive layer is covered by the optically transparent substrate. This prevents the adhesive layer from being exposed to outside air, thereby preventing the degradation of the adhesive layer 6 due to a blue-violet laser.