Semiconductor Transfer Structure With Traps for Display Alignment
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Solution Overview
Problem
Existing technologies face challenges in precisely transferring and repairing semiconductor devices in display apparatuses, particularly in high-resolution displays, leading to increased repair rates and alignment issues.
Innovation Solution
A semiconductor device transfer structure is designed with a substrate, alignment layer, and transfer layer, featuring traps and grooves of specific dimensions and arrangements to accurately seat and align semiconductor devices, utilizing methods like fluid self-assembly transfer to enhance precision and reduce misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer techniques are used, then manufacturing process is simpler, but transfer precision and alignment accuracy deteriorate
Solution Approach 1:
The transfer structure is segmented into multiple functional layers: a substrate, an alignment layer with traps, and a transfer layer with grooves. This segmentation allows each layer to perform its specific function (support, positioning, and transfer) independently, achieving high transfer precision without requiring the entire structure to be complex.
Solution Approach 2:
The alignment layer acts as an intermediary between the substrate and the transfer layer. The traps in the alignment layer provide intermediate positioning points that guide the semiconductor devices into correct alignment before final transfer, thereby improving transfer precision without directly complicating the overall transfer mechanism.
2Reliability
If transfer precision is improved, then repair rate is reduced, but manufacturing complexity increases
Solution Approach 1:
The alignment layer with traps is formed in advance on the substrate before the transfer layer is added. This preliminary action ensures that positioning structures are already in place to guide semiconductor devices during transfer, reducing misalignment and repair rates without requiring complex real-time adjustment mechanisms.
Solution Approach 2:
The structure employs a nested configuration where the alignment layer with traps is embedded within the substrate, and the transfer layer with grooves is placed on top. This nested arrangement allows multiple functional elements to coexist in a compact manner, achieving high reliability without excessive structural complexity.
3Manufacturing precision
If trap depth is increased for better seating, then alignment precision improves, but manufacturing difficulty increases
Solution Approach 1:
The depth of the traps is optimized to a specific parameter range that provides sufficient seating depth for alignment precision while remaining manufacturable. By carefully selecting and controlling the trap depth parameter, the structure achieves high alignment precision without requiring excessively deep or complex trap formations that would increase manufacturing difficulty.
Data Source
AI summary
A semiconductor device transfer structure, a display apparatus, and a method of manufacturing the display apparatus are provided. The semiconductor device transfer structure includes: a substrate; an alignment layer provided on the substrate and including a trap configured to seat a semiconductor device; and a transfer layer provided on the alignment layer and including a groove.