Semiconductor Tray Air Alignment Mechanism
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Solution Overview
Problem
Conventional semiconductor package alignment trays lack an automatic compensation function, leading to suspended operations and reduced productivity when packages go awry, and struggle with precise position alignment due to the absence of an automatic alignment mechanism.
Innovation Solution
A tray with an air position-aligning unit that applies preset air pressure to semiconductor packages through an air channel and injection hole, vibrating the packages to align them within the package pocket portions, which includes a shock-absorbing member and inclined surfaces to ensure proper seating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional buffer trays with inclined pocket portions are used to transfer semiconductor packages at high speed, then transfer speed is improved, but packages may go awry from the pocket portion causing suspension and reduced productivity
Solution Approach 1:
The patent replaces the conventional mechanical inclined surface alignment mechanism with an air-based positioning system. Air channels and air injection holes deliver air pressure to push packages into proper alignment within pocket portions, eliminating the need for mechanical adjustment and manual intervention when misalignment occurs.
Solution Approach 2:
The patent employs pneumatic mechanisms including air channels formed in the buffer tray, air injection holes positioned at critical locations, and air pressure application to automatically position semiconductor packages. This pneumatic system enables automatic compensation for misaligned packages without suspending operations.
2Reliability
If pocket portions are manufactured with larger size to prevent jamming due to outskirt size tolerance, then reliability is improved, but packages may go awry with respect to predetermined position within the pocket portion
Solution Approach 1:
The patent replaces reliance on precise mechanical manufacturing of pocket portions with a pneumatic positioning system. Air pressure applied through strategically positioned air injection holes automatically centers packages within the pocket portions, compensating for manufacturing tolerances and preventing positional drift.
Solution Approach 2:
The patent changes the physical state and pressure parameters of air to achieve precise package positioning. By controlling air pressure magnitude and injection timing, the system dynamically adjusts package position within the pocket portion, maintaining precision despite variations in package dimensions.
3Manufacturing precision
If manual measures are taken when packages go awry from pocket portions, then alignment precision is improved, but operations are suspended and productivity decreases
Solution Approach 1:
The patent implements a self-aligning system where the buffer tray automatically corrects package misalignment through pneumatic action. Air pressure applied through air channels and injection holes pushes out-of-position packages back into proper alignment without requiring operator intervention, enabling continuous operation.
Solution Approach 2:
The system provides automatic feedback-based correction: when a package becomes misaligned, the pneumatic system detects and responds by applying air pressure to restore proper positioning. This closed-loop approach maintains alignment precision while preventing operational suspension.
4Device complexity
If no automatic compensation function is provided in conventional trays, then device complexity is reduced, but alignment precision deteriorates requiring manual intervention
Solution Approach 1:
The patent replaces complex mechanical adjustment mechanisms with a simpler pneumatic system. Air channels and injection holes provide automatic alignment through pressure application, achieving high precision without the complexity of mechanical linkages, sensors, and actuators required in traditional automated systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air position-aligning unit effectively aligns semiconductor packages with improved precision, reducing manual intervention and increasing productivity by automatically correcting misalignments and ensuring precise positioning.
Implementation Method 1
an air position-aligning unit which applies air having a preset pressure to the semiconductor package received in the package pocket portion
Implementation Method 2
The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion, thereby aligning the semiconductor package at the package pocket portion
Data Source
AI summary
A tray for aligning semiconductor packages, a test handler using the same, a method of aligning the semiconductor packages, and a test method using the same include a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.