Semiconductor Transport Tray With Angled Sidewall Guide

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Solution Overview

Problem

Semiconductor devices are prone to detachment during transportation, which can lead to contamination and damage, and existing trays do not effectively stabilize the devices during loading and transport.

Innovation Solution

A tray design featuring a plate with a loading portion and surrounding sidewall portions that include inclined and guide portions forming acute angles, which securely support and guide semiconductor devices to prevent detachment during transport.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional tray without specialized guiding structures is used, then the tray structure is simple, but the semiconductor device may detach during transportation

Engineering Contradiction:
Improvedevice stabilityVSAvoidtray structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sidewall is divided into multiple functional portions: a first inclined portion for initial guidance and a second inclined portion for final positioning. This segmentation allows each portion to perform its specific function optimally, ensuring device stability while maintaining structural clarity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The guiding function is extended from a simple vertical wall to a multi-sloped three-dimensional structure. The first and second inclined portions create a progressive guidance path in multiple dimensions, enabling the device to be gently guided into position while preventing detachment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the semiconductor device is gripped multiple times for proper loading, then the loading precision is improved, but the probability of contamination increases

Engineering Contradiction:
Improveloading precisionVSAvoidcontamination
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The guiding portions are pre-configured to automatically guide the device into the correct loading position and orientation. This preliminary guiding action eliminates the need for multiple gripping and adjustment operations, reducing contamination risk while ensuring precise loading.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The inclined portions are designed to automatically guide the semiconductor device into the loading portion through gravity and geometric constraints. The device self-aligns and self-positions without requiring multiple manual or mechanical gripping operations, thereby reducing contamination probability.

Inventive Principle:
Principle #25Self-service

3Reliability

If a sidewall with single inclined portion is used, then the structure is simple, but the device cannot be securely fixed during transport

Engineering Contradiction:
Improvedevice fixationVSAvoidsidewall structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sidewall is segmented into a first inclined portion and a second inclined portion with different angles. The first portion provides initial guidance with a larger angle, while the second portion provides secure fixation with a smaller angle, creating a progressive constraint system that reliably secures the device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the sidewall have different local qualities in terms of inclination angle. The first inclined portion has a larger angle for guidance, while the second inclined portion has a smaller angle for secure fixation. This local differentiation optimizes both guidance and fixation functions.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The tray design ensures stable loading and transport of semiconductor devices, reducing the risk of contamination and damage by securely fixing the devices through friction and gentle guiding mechanisms.

Implementation Method 1

securely fixing the devices through friction and gentle guiding mechanisms

Methodology Applied
Scientific EffectFriction: Friction

Implementation Method 2

a first inclined portion extending from the loading portion and defining a first angle with respect to an upper surface of the loading portion, and a first guide portion extending from the first inclined portion and defining a second angle with respect to the upper surface of the loading portion

Methodology Applied
Scientific EffectGeometric constraint: Geometry

Data Source

PatentUS20240286788A1Tray for transporting semiconductor device and tray system comprising the same
Publication Date: 2024.08.29 SAMSUNG ELECTRONICS CO LTD
  • US20240286788A1 patent drawing
  • US20240286788A1 patent drawing
  • US20240286788A1 patent drawing

AI summary

A tray for transporting a semiconductor device includes a plate, a loading portion on the plate and configured to support the semiconductor device, and a sidewall portion on the plate and surrounding at least a portion of the loading portion, wherein the sidewall portion includes a first sidewall, and the first sidewall includes a first inclined portion extending from the loading portion and defining a first angle with respect to an upper surface of the loading portion, and a first guide portion extending from the first inclined portion and defining a second angle with respect to the upper surface of the loading portion, the second angle being smaller than the first angle, and the first angle and the second angle are acute angles.