Semiconductor Module Tray with Partitioned Anti-Warpage Support
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Solution Overview
Problem
Existing module trays for semiconductor devices face challenges in efficiently accommodating and protecting multiple semiconductor substrates, particularly in preventing collisions and warpage, while also ensuring stability and safety during transportation and storage.
Innovation Solution
The module tray design includes a base plate with vertical sidewalls and a dividing wall that separates the accommodation space into two areas, featuring curved guide grooves and fastening guides with widening grooves to securely hold semiconductor substrates, along with reinforcing grooves and a cover for enhanced protection and stacking capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor substrates are accommodated in one module tray to meet international standards and improve process efficiency, then the quantity of substrates transported is increased, but the risk of collisions and warpage between substrates increases
Solution Approach 1:
The accommodation space is divided into multiple regions by partition walls, with each region containing a specific number of semiconductor substrates. This segmentation prevents substrates from different areas from colliding with each other, thereby maintaining substrate stability while increasing the total quantity accommodated in the tray.
Solution Approach 2:
Fastening guides are provided at specific locations within each region to selectively fasten semiconductor substrates. The fastening guides accommodate the ends of substrates and prevent warpage by providing localized support at critical positions, ensuring that substrates remain stable in their specific regions without interfering with adjacent substrates.
2Ease of operation
If guide grooves with curved concave shapes are provided to guide substrates into fastening guides, then the ease of substrate insertion is improved, but the device complexity increases
Solution Approach 1:
Guide grooves with curved concave shapes are pre-formed in the tray structure to automatically guide semiconductor substrates into the correct position and orientation. This preliminary guiding action simplifies the insertion process by providing a self-aligning mechanism, reducing the need for complex external positioning devices.
Solution Approach 2:
The guide grooves feature curved concave shapes that naturally guide substrates along a curved path into the fastening guides. This curvature design provides smooth guidance and automatic alignment, improving ease of insertion while maintaining a relatively simple tray structure through geometric design rather than complex mechanical components.
3Reliability
If fastening guides with widening grooves are used to accommodate substrate ends, then the reliability of substrate fastening is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The fastening guides feature grooves with varying cross-sectional dimensions along their length, with the groove width gradually changing from the opening to the bottom. This parameter variation allows the groove to adapt to substrate ends, providing reliable fastening through geometric interlocking while reducing sensitivity to manufacturing tolerances through the gradual transition design.
Data Source
AI summary
A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.