Semiconductor Tray With Tiered Projections For Vibration Stability
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Solution Overview
Problem
Conventional trays for semiconductor devices lack sufficient carrying stability during transportation, leading to potential damage and increased production costs due to vibrations causing semiconductor devices to be dislodged and compressed by stacked trays.
Innovation Solution
The tray features tiered projections with inclined and upright surface portions that create an enclosed space for the semiconductor device, providing enhanced stability by guiding the device back into position and preventing damage, and reinforcing projections that ensure secure stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional trays use simple L-shaped ribs for positioning, then the device complexity is low and ease of manufacture is high, but the carrying stability during transportation is insufficient causing semiconductor devices to be dislodged
Solution Approach 1:
The positioning unit is segmented into multiple independent tiered projections (first, second, third, and fourth tiered projections) arranged around the enclosed space. Each projection independently restrains the semiconductor device, providing multi-directional stability during transportation while maintaining a modular structure that is relatively simple to manufacture.
Solution Approach 2:
The positioning structure transitions from a two-dimensional planar L-shaped rib configuration to a three-dimensional tiered projection arrangement with height variations. The tiered projections have different levels (first tier at a first level, second tier at a second level) that create an enclosed space, adding vertical dimensionality to enhance carrying stability without significantly increasing manufacturing complexity.
2Ease of operation
If spacing is provided between adjacent L-shaped ribs to facilitate placement and removal, then the ease of operation is improved, but the restraining capability is reduced allowing devices to bounce out during vibration
Solution Approach 1:
The positioning unit uses multiple segmented tiered projections arranged around the enclosed space rather than continuous ribs. This segmentation allows adequate spacing between projections for easy device placement and removal while each projection provides localized restraining force to prevent device bounce during vibration and transportation.
Solution Approach 2:
Each tiered projection has locally optimized geometry with inclined surfaces and upright surfaces positioned to provide maximum restraining capability at critical locations. The local quality of each projection is enhanced to compensate for the spacing between projections, ensuring both ease of operation and reliable restraining capability.
Data Source
AI summary
A tray for semiconductor devices includes a base with a positioning unit. The positioning unit includes a plurality of tiered projections which jointly define and surround an enclosed space for receiving a semiconductor device. Each tiered projection is a two-tier structure including an inclined surface portion and an upright surface portion connected to the inclined surface portion, and a semiconductor device can be received, and limited in position, between the upright surface portions. When the tray bounces due external vibrations such that the semiconductor device received in the enclosed space is moved away from the upright surface portions to the inclined surface portions, the inclined surface portions of the tiered projections can guide and adjust the semiconductor device, returning the semiconductor device to between the upright surface portions, in order for the tray to carry the semiconductor device stably.