Semiconductor Package Trench Segmentation for Warpage Reduction
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Solution Overview
Problem
Conventional semiconductor packages face reliability issues due to thermal expansion mismatch between semiconductor elements and substrates, leading to solder ball damage and open circuits, which worsen with larger element sizes.
Innovation Solution
Incorporating a filler with a different coefficient of thermal expansion (CTE) into the semiconductor element, which divides the main body into individual blocks, reducing overall warpage and enhancing reliability by allowing independent block warpage rather than cumulative warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the semiconductor element becomes larger, then the stacking capacity increases, but the warpage damage to solder balls becomes more severe
Solution Approach 1:
The semiconductor element is divided into multiple blocks separated by trenches. Each block can warp independently without affecting other blocks, preventing cumulative warpage across the entire element. This segmentation allows larger element sizes while maintaining solder ball integrity by isolating warpage effects to individual blocks.
2Reliability
If the semiconductor element is bonded to the substrate, then electrical connection is established, but CTE mismatch causes warpage and solder ball damage
Solution Approach 1:
The element is segmented into blocks by trenches, allowing each block to accommodate thermal expansion independently. This reduces the overall warpage degree while maintaining electrical connections through conductive vias that pass through the blocks.
Solution Approach 2:
The coefficient of thermal expansion (CTE) of the semiconductor element is adjusted by selecting materials with appropriate CTE values for the blocks and filler. This parameter modification reduces CTE mismatch with the substrate, thereby reducing warpage while maintaining reliable electrical connections.
3Shape
If filler is added to adjust CTE, then warpage is reduced, but device structure becomes more complex
Solution Approach 1:
The structure is segmented into blocks with trenches, where filler material is placed in the trenches. This segmentation approach reduces warpage through independent block deformation while the filler provides CTE adjustment. The modular nature of this segmentation actually simplifies the overall design compared to uniformly complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage and increases the reliability of semiconductor packages, especially for larger elements, by adjusting the CTE of the semiconductor element and allowing for more efficient heat management, thus extending the service life and enabling more chips to be stacked.
Implementation Method 1
a CTE of the filler is different from that of the main body and the conductive vias
Implementation Method 2
As the material of the semiconductor element is different from that of the substrate, their coefficients of thermal expansion (CTEs) are also typically different. When the conventional stacked package is heated, as the CTE of the material of the semiconductor element is different from that of the substrate, their degrees of warpage are different
Data Source
AI summary
The present disclosure relates to a semiconductor package and a manufacturing method thereof. The semiconductor package includes a semiconductor element including a main body, a plurality of conductive vias, and at least one filler. The conductive vias penetrate through the main body. The filler is located in the main body, and a coefficient of thermal expansion (CTE) of the filler is different from that of the main body and the conductive vias. Thus, the CTE of the overall semiconductor element can be adjusted, so as to reduce warpage.