3D Semiconductor TSV Reduction via Serial Data Transmission
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Solution Overview
Problem
Three-dimensional semiconductor apparatuses face challenges in reducing the number of through-silicon vias (TSVs) required for data input/output connections, which increases chip size and complicates data transmission due to the large number of data lines, leading to issues with fabrication area and current consumption.
Innovation Solution
A semiconductor apparatus configuration with independent write and read data transmission units using TSVs, allowing for reduced TSV count by separating data input/output lines into serial and parallel paths and using output timing adjustment units to manage signal skew, thereby improving data transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of data input/output lines is increased to handle large data transmission, then the data transmission capacity is improved, but the number of TSVs required increases, reducing the chip fabrication area
Solution Approach 1:
The patent segments the data transmission function into two separate chips: a first chip that converts parallel data to serial data, and a second chip that converts serial data back to parallel data. This segmentation allows the use of fewer TSVs for connection while maintaining high data transmission capacity through serial communication protocols.
Solution Approach 2:
The patent transitions from parallel data transmission (multiple simultaneous data lines) to serial data transmission (single time-multiplexed data line). This dimensional change in data transmission approach reduces the number of TSVs from potentially hundreds to just a few, significantly increasing chip fabrication area.
2Adaptability or versatility
If the number of TSVs is increased to connect all data input/output lines, then the data transmission connectivity is improved, but the layout margin of the chip is reduced
Solution Approach 1:
The patent divides the data transmission system into separate functional blocks on different chips, with the first chip handling parallel-to-serial conversion and the second chip handling serial-to-parallel conversion. This segmentation reduces inter-chip connection requirements and improves layout flexibility.
3Device complexity
If all data signals are transmitted through TSVs between chips, then the electrical connection is simplified, but the current consumption increases due to large load
Solution Approach 1:
The patent segments the data transmission architecture into two chips with dedicated conversion functions, allowing the use of fewer TSVs with lower individual current loads. The serial communication protocol further reduces the total current consumption compared to driving numerous parallel signals across TSVs.
Data Source
AI summary
A semiconductor apparatus includes a multi-chip module which multi-chip module comprises a first and a second chips. The semiconductor apparatus comprises a first data line in the first chip to carry first read data; a first controller, in the first chip, configured to generate first output data on a first output data line in the first chip based on the first read data transmitted from the first data line; a first data transmitter configured to electrically connect the first output data line to the second chip.