Semiconductor Tweezers for Real-Time Tissue Characterization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current surgical procedures for intestinal anastomosis, such as stapling, face challenges with tissue healing due to mismatches in staple size and intestinal wall thickness, leading to dehiscence rates of 1-7%, resulting in increased morbidity, mortality, and healthcare costs.
Innovation Solution
Development of semiconductor-based medical tweezers with integrated microscale sensors and actuators that measure tissue properties like thickness and mechanical compliance, enabling real-time data transmission for optimal staple selection or alternative suturing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional stapling devices are used for intestinal anastomosis, then the surgical procedure can be performed quickly, but tissue healing is compromised due to mismatches in staple size and intestinal wall thickness
Solution Approach 1:
The patent applies preliminary action by measuring tissue properties (thickness, compliance, electrical characteristics) before performing the stapling procedure. The smart tweezers characterize the tissue in advance, allowing surgeons to select appropriate staple sizes and configurations before anastomosis, thereby preventing healing complications while maintaining surgical efficiency
Solution Approach 2:
The patent implements feedback by using sensors in the tweezers to detect real-time tissue properties and providing this information to the surgical system. This feedback loop enables dynamic adjustment of stapling parameters based on actual tissue characteristics, improving healing outcomes without significantly extending procedure time
2Measurement precision
If multiple tissue measurement methods are used (optical, mechanical, electrical), then tissue characterization accuracy improves, but device complexity increases
Solution Approach 1:
The patent merges multiple sensing modalities (optical, mechanical, electrical) into a single integrated smart tweezer device. By combining these measurement capabilities in one tool, the patent achieves comprehensive tissue characterization without requiring multiple separate devices, thereby improving measurement precision while managing device complexity through integration
Solution Approach 2:
The patent applies universality by designing the smart tweezers to perform multiple functions: mechanical grasping, optical imaging, mechanical compliance measurement, and electrical property detection. This multi-functional device consolidates what would otherwise require several separate instruments, improving tissue characterization accuracy while maintaining reasonable device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor tweezers provide accurate, real-time tissue characterization, potentially reducing dehiscence rates, saving patients from catastrophic complications, and reducing healthcare costs by guiding surgeons in choosing appropriate anastomotic techniques.
Implementation Method 1
an electrode to measure an electrical potential
Implementation Method 2
an electrical permittivity sensor to measure electrical permittivity
Implementation Method 3
a strain gauge to measure mechanical compliance
Implementation Method 4
a transducer element operable to transmit sonic pulses at the two leg components
Implementation Method 5
a receiver element operable to receive the transmitted sonic pulses and to determine the distance between the two leg components
Data Source
AI summary
Devices, systems, and techniques are disclosed for intelligent semiconductor based medical tweezers and instrumentation including microscale sensors, actuators and circuitry for tissue detection and characterization. In one aspect, a tweezer device includes a hinge structure to enable tweezing motion of the device for clamping a sample, two leg components coupled to the hinge structure, a plurality of microprobes configured on both of the two leg components, and an electronic circuit electrically coupled to the microprobes to process and/or transmit the electronic signals. The microprobes include sensors in a sensing tip structured to penetrate into the sample when the device clamps the sample and produce electronic signals from the sensors of a property of the sample, the sensors of the sensing tip including at least one of an electrode to measure an electrical potential, an electrical permittivity sensor to measure electrical permittivity, or a strain gauge to measure mechanical compliance.