Ultrasonic Flap Airflow Package for Semiconductor Heat Dissipation
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Solution Overview
Problem
The challenge of effective heat management and dissipation in electronic devices, particularly in devices that require complex computations and generate significant heat, such as smartphones and data center servers, is critical for maintaining performance and efficiency.
Innovation Solution
An airflow generating package is introduced, featuring a base, covering structure, and a film structure with flaps that operate at ultrasonic rates to produce airflow, along with airflow generating chips that can be disposed on, under, or beside operational components to dissipate heat, utilizing fin-type heat conductive components and multiple airflow generating chips to enhance airflow direction and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional passive heat dissipation methods are used, then device structure remains simple, but heat dissipation effectiveness is insufficient for high-performance computing
Solution Approach 1:
The patent replaces traditional mechanical fans with an ultrasonic vibration-based airflow generation system. The ultrasonic airflow generator uses high-frequency mechanical vibrations (20 kHz or higher) to generate acoustic waves that move air molecules, creating effective airflow for heat dissipation without rotating mechanical parts. This substitution resolves the contradiction by providing active heat dissipation with reduced mechanical complexity and improved reliability.
Solution Approach 2:
The patent employs periodic ultrasonic vibrations at high frequency (20 kHz or above) to generate continuous airflow. The ultrasonic diaphragm or membrane oscillates back and forth at these high frequencies, creating periodic pressure waves that propagate air molecules in a directional flow. This periodic action enables sustained heat dissipation effectiveness while maintaining a compact, fanless structure.
2Volume of moving object
If device size is reduced for portability, then device becomes more compact, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes pneumatic principles by generating acoustic waves (sound waves) that propagate through air to create airflow. The ultrasonic vibration source creates pressure variations in the air medium, and these pneumatic waves carry momentum to move air molecules directionally. This approach enables effective heat dissipation in a compact volume by using the air itself as the heat transfer medium, driven by acoustic energy rather than large mechanical components.
Solution Approach 2:
The patent changes the operating parameters from low-frequency mechanical rotation (fans) to high-frequency ultrasonic vibration (20 kHz or above). This parameter change allows the system to generate sufficient airflow velocity and pressure for effective heat dissipation within a much smaller volume. The high frequency enables compact dimensions while maintaining or enhancing heat dissipation capability compared to traditional fan systems.
3Temperature
If multiple airflow generating chips are used to enhance heat dissipation, then heat dissipation performance improves, but device complexity increases
Solution Approach 1:
The patent combines multiple airflow generation functions into an integrated ultrasonic airflow generator module that can be positioned strategically around the heat source. Instead of using separate fans at different locations, the system merges the airflow generation capability into a unified ultrasonic device that can create multi-directional airflow patterns through strategic placement and vibration mode control, reducing overall system complexity while maintaining effective heat dissipation.
Solution Approach 2:
The ultrasonic airflow generator serves multiple functions simultaneously: it generates directional airflow for heat dissipation, operates as a fanless solution reducing mechanical failure points, and can be integrated with the device housing or heat sink structure. This multi-functionality reduces the need for separate dedicated components, thereby improving heat dissipation performance without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by operational components, improving device performance and efficiency by utilizing airflow to manage heat effectively, particularly in compact electronic devices.
Implementation Method 1
The flap pair operates at an ultrasonic rate so that the airflow generating package produces an airflow
Implementation Method 2
the airflow generating package produces an airflow
Implementation Method 3
The fin-type heat conductive component is disposed on a heat source
Implementation Method 4
The airflow flows through the fin-type heat conductive component and is configured to dissipate a heat from the heat source
Data Source
AI summary
An airflow generating package includes a base, a covering structure and a film structure. The film structure is disposed between the base and the covering structure, and includes a flap pair including a first flap and a second flap. The flap pair operates at an ultrasonic rate so that the airflow generating package produces an airflow. A first air opening is formed on the covering structure.