Semiconductor Package With Undercut Encapsulant and Cover Layer
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The semiconductor device design incorporates a substrate with electronic devices on both sides, encapsulants with undercuts, and a cover layer that extends adjacent to the undercut, providing protection and electrical connections while minimizing package size and enhancing reliability through a novel encapsulation and shielding approach.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost is high and reliability is decreased
Solution Approach 1:
The encapsulation structure is divided into multiple segments including a first encapsulant material covering the electronic device, a second encapsulant material forming an undercut structure, and a cover layer with top and side portions. This segmentation allows each part to perform specific functions independently, improving overall reliability while managing complexity through functional specialization.
Solution Approach 2:
The patent employs a nested structure where the electronic device is embedded within the first encapsulant material, which is itself covered by the cover layer. The second encapsulant material with undercut structure is nested within the overall package, creating a multi-layer nested arrangement that protects the device while maintaining a compact form factor.
2Volume of moving object
If conventional packages are used, then manufacturing process is traditional, but package size is too large
Solution Approach 1:
The patent transitions from traditional planar packaging to a three-dimensional structure with vertical layering. The cover layer extends in multiple dimensions with a top cover portion and a side cover portion that wraps around sides, utilizing vertical space efficiently to reduce the package footprint while maintaining protection.
Solution Approach 2:
The cover layer is formed as a thin film structure that conformally covers the electronic device and encapsulant materials. This thin film approach reduces the overall package volume compared to bulky conventional enclosures, while the flexible side cover portion adapts to the underlying structure to provide comprehensive protection in a compact form.
3Object-affected harmful factors
If conventional encapsulation is used, then structure is simple, but protection from environmental exposure and EMI is insufficient
Solution Approach 1:
The patent employs composite encapsulation using different materials with complementary properties. The first encapsulant material provides basic environmental protection, the second encapsulant material with undercut structure offers mechanical support and stress relief, and the cover layer provides additional protection and EMI shielding. This composite approach enhances protection against harmful factors while distributing functionality across multiple material layers.
Solution Approach 2:
The undercut structure of the second encapsulant material is designed in advance to provide stress relief and accommodate thermal expansion before environmental damage can occur. The multi-layer encapsulation structure is pre-configured to absorb and dissipate environmental stressors and electromagnetic interference, providing beforehand cushioning against potential harm.
4Reliability
If conventional packages are used, then cost is high, but performance is relatively low
Solution Approach 1:
The patent merges multiple functions into an integrated encapsulation structure. The cover layer simultaneously provides environmental protection, EMI shielding, and mechanical support. The undercut structure of the second encapsulant material combines stress relief with space optimization. This merging of functions into unified structural elements improves device performance while avoiding the need for separate protective components that would increase complexity.
Data Source
AI summary
In one example, a semiconductor device, comprising a substrate having a top side and a bottom side, an electronic device on the top side of the substrate, a first encapsulant on the top side of the substrate contacting a side of the electronic device, a second encapsulant on the bottom side of the substrate, wherein the second encapsulant includes an undercut at an end of the second encapsulant, and a cover layer comprising a top cover on a top side of the first encapsulant and a side cover on a side of the first encapsulant and a side of the substrate, wherein the side cover extends adjacent to the undercut. Other examples and related methods are also disclosed herein.