Semiconductor Package Underfill and Dummy Bumps Warpage Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packages face challenges in reliability and performance due to issues with electrical connectivity, thermal management, and warpage, which are not adequately addressed by existing technologies.
Innovation Solution
The semiconductor package design includes a semiconductor chip on a package substrate with an under-fill layer, conductive bumps, and a passivation layer with strategically positioned holes, along with dummy conductive bumps that are electrically floated, to enhance electrical connectivity, thermal management, and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires or bumps are used to electrically connect the semiconductor chip to the printed circuit board, then electrical connectivity is achieved, but reliability and durability are insufficient
Solution Approach 1:
The patent segments the electrical connection system into multiple independent paths by providing both wired connections (bonding wires) and wireless connections (conductive bumps) between the semiconductor chip and printed circuit board. This segmentation allows the system to maintain electrical connectivity through alternative paths if one connection method fails, thereby improving reliability without significantly increasing overall device complexity
Solution Approach 2:
The patent changes the connection parameters by introducing conductive bumps with different electrical and mechanical properties compared to traditional bonding wires. The conductive bumps provide direct electrical contact with improved signal integrity and reduced inductance, while the bonding wires provide flexible mechanical connection. This parameter diversification enhances overall connection reliability
2Stability of the object's composition
If the semiconductor chip is mounted on the printed circuit board, then electrical connectivity is established, but warpage occurs affecting package stability
Solution Approach 1:
The patent applies the counterweight principle by strategically placing dummy conductive bumps around the active conductive bumps on the printed circuit board. These dummy bumps act as counterweights that balance the thermal expansion and mechanical stress distribution, compensating for the warpage caused by the mounted semiconductor chip and improving overall package stability
Solution Approach 2:
The patent applies local quality by creating different structural zones: the central area contains the semiconductor chip with active electrical connections, while the peripheral areas contain dummy conductive bumps that provide mechanical support and stress distribution without electrical connectivity. This localized differentiation addresses warpage in specific regions without affecting the overall electrical functionality
3Temperature
If conventional packaging structures are used, then manufacturing is simplified, but thermal management is inadequate
Solution Approach 1:
The patent applies multi-functionality by designing the conductive bumps to serve dual purposes: electrical connection and thermal conduction. The same metallic structures that provide electrical pathways between the chip and PCB also act as heat sinks and thermal conduction paths, efficiently managing heat dissipation without requiring separate thermal management components
Solution Approach 2:
The patent employs composite material structures in the packaging system, combining different materials with complementary properties. The package substrate integrates materials with high thermal conductivity for heat dissipation, while the molding compound provides thermal insulation and mechanical protection. This composite approach enhances thermal management capabilities while maintaining reasonable structural complexity
Data Source
AI summary
Semiconductor packages may include a semiconductor chip on a substrate and an under-fill layer between the semiconductor chip and the substrate. The semiconductor chip may include a semiconductor substrate including first and second regions, and an interlayer dielectric layer that may cover the semiconductor substrate and may include connection lines. First conductive pads may be on the first region and may be electrically connected to some of the connection lines. Second conductive pads may be on the second region and may be electrically isolated from all of the connection lines. The semiconductor chip may also include a passivation layer that may cover the interlayer dielectric layer and may include holes that may expose the first and second conductive pads, respectively. On the second region, the under-fill layer may include a portion that may be in one of the first holes and contact one of the second conductive pads.