Semiconductor Device Underfill Resin Layer Adhesion
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Solution Overview
Problem
The existing semiconductor devices face issues with insufficient adhesion between the mold resin and the substrate, leading to peeling problems during the manufacturing process.
Innovation Solution
A semiconductor device configuration is introduced, where a resin layer with a thickness of 200 nm or less is formed between the cured mold resin layer and the substrate, covering at least 30% of the semiconductor chip's periphery, using epoxy or acrylic resins to enhance adhesion and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mold resin layer is formed directly on the substrate, then the manufacturing process is simple, but adhesion between the mold resin and substrate is insufficient causing peeling
Solution Approach 1:
An underfill agent layer is introduced as an intermediary between the substrate and the mold resin layer. This underfill agent serves as a mediator that enhances adhesion between the substrate and mold resin, preventing peeling while maintaining manufacturing simplicity. The underfill agent is applied to the substrate before mounting the semiconductor chip, creating a bonding interface that improves reliability.
2Reliability
If the underfill agent layer is made thicker to improve adhesion, then peeling resistance increases, but the distance between the mold resin and substrate increases affecting device performance
Solution Approach 1:
The thickness of the underfill agent layer is precisely controlled within the range of 1 µm to 10 µm. This parameter optimization ensures sufficient adhesion and peeling resistance while minimizing the distance between the mold resin and substrate. The specific thickness range balances the competing requirements of mechanical strength and electrical performance.
3Reliability
If a resin layer is formed between the mold resin and substrate, then adhesion is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The underfill agent layer performs multiple functions simultaneously: it enhances adhesion between the substrate and mold resin, provides mechanical support, enables flip-chip bonding, and improves heat dissipation. By combining multiple functions into a single layer, the manufacturing process complexity is minimized while achieving reliable adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the reliability of the semiconductor device by suppressing peeling between the mold resin and the substrate, ensuring strong adhesion and maintaining performance even after reflow tests.
Implementation Method 1
a resin layer 50 different from the mold resin layer 40 and having a thickness of 200 nm or less is provided between the cured mold resin layer 40 and the substrate 10
Data Source
AI summary
An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor device 1 includes a semiconductor chip 20 and a substrate 10 that are molded with a mold resin layer 40. The semiconductor device 1 includes a resin layer 50 having a thickness of 200 nm or less different from the mold resin layer 40 between the cured mold resin layer 40 and the substrate 10. The resin layer 50 present between the mold resin layer 40 and the substrate 10 is preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.