Semiconductor Unit Cooling with Segmented Coolers
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Solution Overview
Problem
The existing semiconductor unit's cooling efficiency for semiconductor modules is insufficient as the reactor is cooled first, which affects the cooling performance of the modules.
Innovation Solution
The semiconductor unit design rearranges the cooling process by cooling the semiconductor modules before the reactor, using a separate second cooler connected via a coolant discharge pipe, and optionally includes additional reactors and coolers to enhance cooling efficiency, allowing for prioritized cooling of semiconductor modules and additional components like voltage converters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the reactor is cooled first and then the semiconductor modules are cooled, then the reactor cooling is ensured, but the cooling efficiency for the semiconductor modules deteriorates
Solution Approach 1:
The cooling system is divided into two independent parts: first coolers for semiconductor modules and a second cooler for the reactor. Each cooler operates independently with separate coolant circulation paths, allowing simultaneous cooling of both components without thermal interference.
Solution Approach 2:
A connection pipe with a branch structure serves as an intermediary component, enabling the coolant to flow from the first coolers to the second cooler. This intermediary structure facilitates independent cooling paths while maintaining system integration.
2Ease of manufacture
If the second cooler is fabricated integrally with the first coolers, then the structural integrity is improved, but the ease of manufacture deteriorates
Solution Approach 1:
The second cooler is manufactured as a separate component from the first coolers, allowing each to be optimized and fabricated independently. This segmentation simplifies the manufacturing process while maintaining structural integrity through proper connection design.
Solution Approach 2:
The separately manufactured first coolers and second cooler are connected through a branch structure in the connection pipe, merging them into a functional cooling system that achieves both manufacturing ease and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the cooling efficiency of semiconductor modules by prioritizing their cooling and allows for efficient cooling of multiple reactors and voltage converters, simplifying manufacturing by separating the second cooler from the first coolers.
Implementation Method 1
Each of the semiconductor modules is interposed between a pair of the first coolers arranged adjacently... the semiconductor modules are cooled before the reactor is
Implementation Method 2
The reactor is cooled by a coolant discharged from the first coolers... The second cooler may be connected with the coolant discharge pipe
Implementation Method 3
The coolant discharge pipe may extend along a stacking direction of the semiconductor modules and the first coolers... The one of the first coolers at the one end of the stack and the second cooler are connected via connection pipes on both sides of the reactor
Data Source
AI summary
A semiconductor unit may include first coolers arranged in parallel; semiconductor modules, each of the semiconductor modules being interposed between a pair of the first coolers arranged adjacently; a coolant discharge pipe provided at one of the first coolers that is located at an end of a stack of the first coolers and the semiconductor modules, the coolant discharge pipe extending along a stacking direction of the first coolers and the semiconductor modules; a second cooler connected with the coolant discharge pipe; and a reactor interposed between the second cooler and the one of the first coolers located at the end of the stack.