Semiconductor Valve Load Distribution for Seat Durability

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Solution Overview

Problem

Semiconductor manufacturing valves face challenges in preventing damage to valve seats due to high-pressure fluids, particularly corrosive gases, while maintaining compactness and ensuring reliable sealing without leakage, as existing solutions either compromise on seal performance or durability.

Innovation Solution

A valve design featuring a load distributing member, such as a resin-made ring-shaped load distributing seat or disc spring, that distributes the fastening load between the valve seat and the load distributing member, preventing excessive surface pressure and maintaining compactness by ensuring the thrust required for sealing is distributed effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a strong fastening load is applied to the valve seat to prevent leakage under high pressure, then sealing performance is improved, but the valve seat is prone to damage and plastic deformation

Engineering Contradiction:
Improvesealing performanceVSAvoidvalve seat durability
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent introduces a load distributing member as an intermediary between the diaphragm and the valve seat. This member has a larger area than the valve seat, allowing it to receive the fastening load from the diaphragm and distribute it over a larger area, thereby reducing the surface pressure on the valve seat while still maintaining the necessary sealing force through the smaller valve seat area.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the effective area of the valve seat is increased to reduce surface pressure, then valve seat durability is improved, but the valve outer size increases and compactness is reduced

Engineering Contradiction:
Improvevalve seat durabilityVSAvoidvalve outer size
Core Design Contradiction:
StrengthVSArea of stationary object

Solution Approach 1:

The patent resolves the spatial conflict by introducing the load distributing member with a larger area in a different dimensional arrangement - positioned between the diaphragm and valve seat in the axial direction. This allows the load distribution area to be larger without increasing the radial outer dimensions of the valve, maintaining compactness while improving durability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If a resin material valve seat is used to prevent corrosion from chemical fluids, then chemical resistance is improved, but load-bearing ability is reduced making the valve seat more prone to damage

Engineering Contradiction:
Improvechemical resistanceVSAvoidload-bearing ability
Core Design Contradiction:
Object-affected harmful factorsVSStrength

Solution Approach 1:

The patent creates a composite structure where the load distributing member (made of resin material with chemical resistance) works in conjunction with the valve seat. The load distributing member is designed with larger area to bear and distribute the mechanical load, while the valve seat maintains chemical resistance properties, combining the advantages of both components.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the durability of the valve seat, prevents damage and leakage, and maintains excellent seal performance even under high-pressure conditions, while maintaining the compact size necessary for semiconductor manufacturing applications.

Implementation Method 1

a fastening load required at valve closing is received as being distributed to the valve seat and the load distributing member

Methodology Applied
Scientific EffectLoad distribution:

Implementation Method 2

an opening/closing mechanism which pressurizes the diaphragm to cause valve closing

Methodology Applied
Scientific EffectPressure:

Data Source

PatentUS12117101B2Valve for semiconductor manufacturing device
Publication Date: 2024.10.15 KITZ SCT CORP
  • US12117101B2 patent drawing
  • US12117101B2 patent drawing
  • US12117101B2 patent drawing

AI summary

A valve for semiconductor manufacturing device is provided in which an excessive surface pressure to the valve seat is prevented to improve durability. The valve main body (1) has a duplexed structure in which, a load distributing member (10) is arranged in serial to the valve seat (7) inside of the opening/closing mechanism (8) of the valve main body (1) while a thrust produced by the opening/closing mechanism (8) is maintained, a fastening load required is received as being distributed to the valve seat (7) and the load distributing member (10).