Semiconductor Device Vertical Header Partition Wall
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Solution Overview
Problem
The miniaturization of semiconductor devices is hindered by the need for larger base plates to accommodate both cooling fins and headers, leading to increased pressure loss and reduced refrigerant flow, which deteriorates cooling performance and complicates the manufacturing process.
Innovation Solution
A semiconductor device design featuring a header partition wall formed separately from the jacket, fixed to the lower side of the cooling fins, allowing for vertical refrigerant flow and reducing the size of the base plate required for sealing, while preventing undercut portions and improving workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a header is provided horizontally on the base plate to equalize refrigerant flow velocity, then cooling performance is improved, but the base plate size increases, making miniaturization difficult
Solution Approach 1:
The patent transitions the header from a horizontal arrangement (parallel to cooling fins) to a vertical arrangement (perpendicular to cooling fins). This dimensional change allows the header to be positioned above the cooling fins rather than beside them, eliminating the need for additional base plate area while maintaining cooling effectiveness through improved refrigerant distribution.
Solution Approach 2:
The header is positioned to overlap with the cooling fin region vertically, with the header partition wall extending downward to form the header structure. This nesting arrangement allows the header functionality to be integrated within the existing cooling fin footprint, eliminating the need for additional base plate area.
2Area of stationary object
If the base plate size is reduced for miniaturization, then device size is minimized, but pressure loss increases and refrigerant flow decreases
Solution Approach 1:
By reorienting the header vertically, the patent creates sufficient internal volume within the compact base plate for effective refrigerant mixing and distribution. The vertical header structure provides adequate flow capacity without increasing the horizontal footprint, maintaining low pressure loss while enabling miniaturization.
3Area of stationary object
If the header size is reduced to minimize device size, then miniaturization is achieved, but the header lacks capacity to equalize refrigerant flow velocity
Solution Approach 1:
The vertical orientation of the header provides sufficient internal volume for refrigerant mixing and pressure equalization, compensating for the reduced horizontal dimensions. The vertical header structure allows adequate flow capacity and equalization function within a compact footprint.
Solution Approach 2:
The header partition wall extends downward to form the header structure in advance, creating the necessary flow distribution geometry before refrigerant enters the cooling fins. This preliminary structural arrangement ensures proper flow equalization is established from the outset.
4Device complexity
If a partition wall is formed integrally with the jacket to create the header, then device complexity is reduced, but undercut portions are generated deteriorating workability
Solution Approach 1:
The patent separates the header partition wall from the jacket as distinct components. The partition wall is formed separately and then assembled to the jacket, eliminating the undercut portion problem that would occur with integral formation while maintaining the functional integration of the header structure.
Solution Approach 2:
The partition wall is formed as a separate component in advance, allowing it to be manufactured without the undercut portion issues that would arise from integral jacket formation. This preliminary separate manufacturing improves workability while the subsequent assembly achieves the desired integrated functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the miniaturization of semiconductor devices by reducing the base plate size and enhancing cooling performance, while maintaining adequate refrigerant flow and improving manufacturing workability.
Implementation Method 1
a cooling fin (3) disposed on a lower surface of the base plate (2)
Implementation Method 2
causing a refrigerant flow to the cooling fin (3)
Data Source
AI summary
A semiconductor device includes a semiconductor element, a base plate having an upper surface on which the semiconductor element is mounted, a cooling fin disposed on a lower surface of the base plate, a jacket disposed in a sealing manner on the lower surface of the base plate, the jacket surrounding the cooling fin, and a header partition wall formed separately from the jacket and fixed to the jacket on the lower side of the cooling fin in the jacket, the header partition wall forming a header and a flow path for causing a refrigerant flow to the cooling fin.