Semiconductor Device Thermal Management via Vertical Conduction Path
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Solution Overview
Problem
Conventional semiconductor devices face reduced heat dissipation efficiency when the wiring board area is minimized, leading to inadequate heat management due to the use of low-conductivity sealing resins and limited heat dissipation paths.
Innovation Solution
A semiconductor device configuration featuring a wiring board with conductive wiring on an insulating substrate, a semiconductor element with a circuit forming region and electrode pad, and a heat dissipating member, where a high-heat-conductivity filling material is used to directly contact the circuit forming region and heat dissipating member, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the wiring board area is reduced to decrease device size, then the device size is reduced, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The invention transitions from a planar heat dissipation approach (through the wiring board) to a vertical heat dissipation path. By forming a through-hole extending from the front surface to the back surface of the wiring board and filling it with conductive material, heat can escape in the vertical dimension directly from the circuit forming region, bypassing the limitation of reduced wiring board area.
Solution Approach 2:
The invention introduces a conductive filling material as an intermediary substance within the through-hole. This material serves as a thermal conduit, transferring heat from the circuit forming region through the wiring board to the heat dissipating member positioned at the back surface, enabling efficient heat transfer despite the compact device size.
2Ease of manufacture
If conventional sealing resin is used to cover connected portions, then manufacturing is simplified, but heat dissipation efficiency deteriorates due to low thermal conductivity
Solution Approach 1:
The invention introduces a conductive filling material as an intermediary thermal pathway within the through-hole, separating the sealing function (performed by the resin coating layer) from the heat dissipation function (performed by the conductive filling material). This allows each material to optimize its respective function without compromise.
Solution Approach 2:
The invention creates a composite structure where a resin coating layer (for sealing) and a conductive filling material (for heat dissipation) work together in different spatial zones. The resin covers the connected portions for protection and insulation, while the conductive material fills the through-hole for thermal management, achieving both sealing and heat dissipation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures improved heat dissipation efficiency even with a small wiring board area, providing an inexpensive semiconductor device with effective thermal management by utilizing a high-heat-conductivity filling material to transmit heat directly to the heat dissipating member.
Implementation Method 1
A filling material that has a heat conductivity higher than that of the sealing resin is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member
Data Source
AI summary
A semiconductor device of the present invention includes: a wiring board 4 in which a conductive wiring 6 is formed on an insulating substrate 5 having an opening 5a; a semiconductor element 2 that has a circuit forming region 2a and an electrode pad 3, and is mounted on the wiring board with the circuit forming region facing the opening, the electrode pad being connected electrically to the conductive wiring via a protruding electrode 3a; a sealing resin 7 that covers the connected portion between the electrode pad and the conductive wiring; a heat dissipating member 9 that is disposed so as to have a portion facing the opening; and a filling material 8 that has a heat conductivity higher than that of the sealing resin, and is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member. Even when the wiring board has a small area, heat dissipation efficiency can be ensured, and low cost manufacture can be achieved.