Semiconductor Package Via Groups for High-Density Reliable I/O

The patent transitions from planar I/O pad arrangement on the die surface to three-dimensional vertical stacking using multiple die layers connected through through-silicon vias (TSVs). This dimensional change allows I/O pads to be distributed across multiple layers, effectively increasing the total number of I/O pads without increasing the footprint area of individual dies.

The patent implements a stacked die architecture where multiple thin active dies are nested vertically, with each die containing I/O pads on its surface. The dies are interconnected through TSVs that pass through the substrate, creating a nested structure where I/O pads on different layers are vertically aligned or offset to maximize connectivity while minimizing lateral space requirements.

The patent resolves the solder bridge issue by moving the connection function from the lateral plane to the vertical dimension. TSVs provide direct vertical pathways through the substrate, allowing I/O pads to be connected without requiring closely spaced lateral traces. This vertical connectivity eliminates the need for dense lateral routing that would otherwise cause solder bridges.

The patent introduces TSVs as intermediary connection structures that mediate between I/O pads on different die layers. These vias act as vertical conductors that bypass the need for lateral trace routing, thereby eliminating the solder bridge problem associated with high-density lateral pad arrangements while enabling increased I/O pad density.

The patent implements wafer-level packaging where multiple dies are packaged together in a stacked configuration before individualization. This preliminary action allows for batch processing and testing, enabling efficient identification and removal of defective dies while maintaining the integrity of good dies. The stacked structure facilitates group handling and reduces the need for individual die manipulation.

The patent creates individually separable die stacks where each die can be independently tested and identified. The modular stacked structure allows defective dies to be detected and removed from the stack without affecting other dies, enabling efficient defect management while maintaining high I/O pad density through the vertical architecture.