Semiconductor Via-Pad Structure With Dual-Modulus Resin Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The formation of a through via in semiconductor apparatuses can weaken the support of input and output pads, leading to potential breaks or damage between interlayer insulation layers and the pads, which compromises reliability.
Innovation Solution
A semiconductor apparatus design that includes a first substrate, an insulating member, and a second substrate, with a conductive layer and resin layers of different Young's moduli to enhance support rigidity and alleviate stress on the insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through via is formed to pass through the support substrate and reach the input and output pad, then the electrical connection is improved, but the support of the input and output pad is weakened
Solution Approach 1:
The support substrate is divided into a rigid support substrate and a flexible substrate. The through via passes through the rigid support substrate to establish electrical connection, while the flexible substrate provides additional mechanical support to the input and output pad, preventing pad damage while maintaining electrical connectivity.
Solution Approach 2:
The semiconductor apparatus uses a composite structure combining rigid support substrate (providing mechanical strength and via formation) and flexible substrate (providing pad support and stress relief). This composite approach allows the through via to function for electrical connection while the flexible substrate compensates for the weakened pad support.
2Reliability
If a through via is formed, then the electrical connectivity is improved, but the interlayer insulation layer may break or damage due to stress
Solution Approach 1:
The support substrate is segmented into rigid and flexible portions. The rigid support substrate contains the through via for electrical connectivity, while the flexible substrate absorbs and distributes stress away from the interlayer insulation layer, preventing breakage while maintaining electrical connection.
Solution Approach 2:
The substrate structure transitions from a single rigid substrate to a composite of rigid and flexible substrates. This parameter change in material properties allows the system to accommodate thermal expansion and mechanical stress differently, protecting the interlayer insulation layer while preserving via functionality.
3Ease of manufacture
If only a rigid support substrate is used, then the manufacturing is simplified, but the stress distribution is poor and causes damage
Solution Approach 1:
The apparatus employs a composite substrate structure with rigid and flexible layers. The rigid support substrate maintains ease of manufacturing for through via formation, while the added flexible substrate layer provides superior stress distribution and damage prevention, enhancing overall reliability without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the reliability of semiconductor apparatuses by enhancing support rigidity and dispersing stress, thereby reducing the risk of damage during manufacturing and usage.
Implementation Method 1
a first resin layer and a second resin layer are disposed, and the first resin layer is disposed within the opening, is disposed between the electrode pad and the second resin layer, and has a different Young's modulus from the second resin layer
Data Source
AI summary
A semiconductor apparatus comprising a first substrate, a second substrate coupled with the first substrate via an insulating member, a third substrate coupled to the first substrate and disposed on the opposite side to the second substrate and a conductive layer including an electrode disposed between the first and second substrate is provided. A through via is disposed so as to pass through the second substrate and a part of the insulating member to reach the electrode. An opening is arranged overlapping the electrode in the first substrate and a part of the insulating member. First and second resin layers are disposed between the electrode and the third substrate, and the first resin layer is disposed within the opening, is disposed between the electrode and the second resin layer and has a different Young's modulus from the second resin layer.