Semiconductor Via Placement for Resonance Reduction
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Solution Overview
Problem
Existing semiconductor structures face significant challenges in reducing resonance effects and insertion loss between parallel electrical boards, which affect signal transmission quality, and current methods using multiple vias are costly and incomplete in resolving these issues.
Innovation Solution
A semiconductor structure with a wiring layer between two signal layers, featuring vias disposed adjacent to terminals to short-circuit the signal layers, reducing resonance effects and insertion loss by increasing the current backflow path while minimizing the number of vias required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two rows of vias are disposed beside the strip line to reduce resonance effect, then the backflow path is increased and shielding effect is generated, but the number of vias required is large and costs are considerable
Solution Approach 1:
The invention extracts the essential function of via placement from the conventional approach of distributing vias along the entire strip line, and concentrates it at the critical terminals only. This reduces the number of vias from multiple rows along the strip line to just one via per terminal, while still achieving the backflow path and shielding functions where they are most needed.
Solution Approach 2:
The invention applies local quality by placing vias specifically at the terminals where resonance coupling occurs most intensely, rather than uniformly distributing vias along the entire strip line. This targeted approach provides the necessary shielding and backflow path at the critical locations with minimal via count.
2Reliability
If two rows of vias are disposed beside the strip line to reduce resonance effect, then shielding effect is generated, but insertion loss at particular frequency cannot be completely resolved
Solution Approach 1:
The invention converts the harmful resonance coupling effect into a beneficial controlled short-circuit condition by placing vias at terminals. The via creates a deliberate low-impedance path that redirects the resonant energy into the ground layer, converting the harmful resonance into a controlled current path that protects the signal integrity.
3Object-affected harmful factors
If vias are disposed to short-circuit signal layers and increase current backflow path, then resonance coupling is reduced, but the conventional method requires many vias and incurs high costs
Solution Approach 1:
The invention performs preliminary action by pre-establishing the current backflow path through via-connected ground pads at the terminals before the signal enters the strip line. This preliminary grounding arrangement ensures that resonance currents have a predetermined low-impedance return path, preventing resonance coupling from developing in the first place.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively minimizes energy loss in signal transmission, achieving optimal signal integrity and reducing costs compared to conventional methods by strategically placing vias near terminals to reduce resonance coupling.
Implementation Method 1
At least one via is used to conduct the first signal layer and the second signal layer
Implementation Method 2
When resonance frequency occurs, the parallel electrical boards transmits the electromagnetic wave of such resonance frequency
Implementation Method 3
two parallel electrical boards can be regarded as a capacitor under the state of direct current (DC), and which can be regarded as a wave guide in the filed of high frequency micro-wave
Data Source
AI summary
A semiconductor structure comprising a first signal layer, a second signal layer, a wiring layer and at least one via is provided. The wiring layer is formed between the first signal layer and the second signal layer. A conducting wire is disposed between a first terminal and a second terminal on the wiring layer. At least one via is used to conduct the first signal layer and the second signal layer. The at least one via is disposed adjacent to the first terminal and the second terminal.