Semiconductor Package Wafer Bonding to Prevent Upper Wafer Peeling
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Solution Overview
Problem
The challenge in semiconductor packaging is preventing the upper wafer from peeling off due to the absence of a molding layer between the semiconductor chip and the upper layer, which is critical for maintaining package integrity and functionality as devices become smaller and more complex.
Innovation Solution
A method is developed where an adhesive layer is formed between the semiconductor chip and the upper wafer, and a molding layer is formed between the lower and upper wafers to surround the adhesive layer, ensuring the upper wafer is securely bonded and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are integrated into a single package to reduce size, then package capacity and functionality are improved, but the risk of wafer peeling increases due to absent molding layer support
Solution Approach 1:
The patent introduces an adhesive layer as an intermediary substance between the semiconductor chip and the upper wafer to provide bonding support in the absence of a molding layer. This adhesive layer acts as a mediator that compensates for the missing structural support, preventing wafer peeling while enabling multiple chip integration
Solution Approach 2:
The patent modifies the bonding interface parameters by changing from direct wafer-to-chip bonding to adhesive-layer-mediated bonding. This parameter change in the bonding mechanism allows for secure attachment of multiple chips without requiring a molding layer, thus maintaining reliability while achieving high package capacity
2Reliability
If adhesive layer width is increased beyond chip width to ensure bonding coverage, then bonding reliability is improved, but material usage and process complexity increase
Solution Approach 1:
The adhesive layer is prepared and positioned in advance with a predetermined width greater than the chip width before the bonding process. This preliminary preparation ensures adequate bonding coverage and reliability without requiring complex real-time adjustments during assembly, thus managing process complexity while maintaining high bonding reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents the upper wafer from peeling off, enhancing the structural integrity and functionality of semiconductor packages by ensuring a secure bonding process, even in compact and high-capacity designs.
Implementation Method 1
forming an adhesive layer between a semiconductor chip and the upper wafer
Implementation Method 2
bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer
Data Source
AI summary
A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer.