Semiconductor Wafer Film With Stable Modulus Across Temperature Shifts
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Solution Overview
Problem
Existing semiconductor manufacturing methods require frequent changes of adhesive films during evaluation, segmenting, and pickup steps, which are inefficient and increase productivity costs due to temperature changes and the need for specific adhesive films for each step.
Innovation Solution
A film with a base layer and adhesive layer, where the base layer has a specific tensile elastic modulus ratio that maintains flexibility across temperature changes, allowing for common use in evaluation, segmenting, and pickup steps without the need for frequent film changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different adhesive films are used for different manufacturing steps (evaluation, segmenting, pickup), then each step can be optimized for its specific requirements, but the process complexity and time consumption increase due to frequent film changes
Solution Approach 1:
The patent applies universality by designing a single adhesive film that can perform multiple functions across different manufacturing steps. The film is engineered with specific adhesive properties that allow it to function effectively during evaluation, segmenting, and pickup operations without requiring changes between steps, thereby eliminating film change time while maintaining step-specific optimization.
Solution Approach 2:
The patent merges the requirements of multiple manufacturing steps into a single adhesive film design. By combining the adhesive properties needed for evaluation, segmenting, and pickup into one film formulation, the patent eliminates the need for separate films for each step, reducing process complexity and time consumption.
2Reliability
If adhesive films are changed frequently between manufacturing steps, then each step can use the most suitable film, but productivity decreases due to increased manual operations
Solution Approach 1:
The patent applies universality by designing a single adhesive film that can perform multiple functions across different manufacturing steps. The film is engineered with specific adhesive properties that allow it to function effectively during evaluation, segmenting, and pickup operations without requiring changes between steps, thereby eliminating film change time while maintaining step-specific optimization.
Solution Approach 2:
The adhesive film is designed to automatically maintain its adhesive properties throughout the manufacturing process without requiring manual intervention for changes. The film's self-contained design with controlled adhesive layers allows it to serve all manufacturing steps independently, reducing manual operations and increasing productivity.
3Productivity
If a single adhesive film is used for all manufacturing steps, then productivity increases by eliminating film changes, but the film must compromise on optimal performance for each specific step
Solution Approach 1:
The patent applies composite materials by creating an adhesive film with multiple layers having different properties. The base layer provides structural support while the adhesive layers are formulated with specific characteristics to optimize performance across different manufacturing steps. This composite structure allows the single film to maintain optimal adhesive performance for evaluation, segmenting, and pickup operations simultaneously.
Solution Approach 2:
The patent applies local quality by designing different regions or layers of the adhesive film with specialized properties. The adhesive layer is formulated with specific tackiness and bonding characteristics that are optimized for each manufacturing step's local requirements, allowing the single film to deliver step-specific performance without compromise.
4Reliability
If adhesive films are optimized for specific temperature conditions, then performance at those temperatures improves, but the film becomes less adaptable to temperature changes during operational evaluation
Solution Approach 1:
The patent applies parameter changes by designing the adhesive film with materials and formulations that maintain stable adhesive properties across a wide temperature range. The adhesive composition is engineered to resist temperature-induced property changes, allowing the film to adapt to temperature variations during operational evaluation while maintaining reliable performance.
Solution Approach 2:
The patent applies composite materials by creating an adhesive film with multiple layers having different properties. The base layer provides structural support while the adhesive layers are formulated with specific characteristics to optimize performance across different manufacturing steps. This composite structure allows the single film to maintain optimal adhesive performance for evaluation, segmenting, and pickup operations simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity by enabling the use of a single film across multiple steps, reducing man-hours and improving the yield of semiconductor and electronic devices by maintaining flexibility and heat resistance.
Implementation Method 1
the base layer has a specific tensile elastic modulus ratio that maintains flexibility across temperature changes
Implementation Method 2
an adhesive layer disposed on one surface side of the base layer... the adhesive layer is bonded to a back surface of a semiconductor wafer
Data Source
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AI summary
The present invention provides a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. That is, a film 1 for manufacturing a semiconductor part includes a base layer 11, and an adhesive layer 12 disposed on one surface side of the base layer 11, wherein the ratio RE (= E'(160)/E'(-40)) of the elastic modulus of E'(160) of the base layer 11 at 160°C to the elastic modulus of E'(-40) of the base layer 11 at -40°C is such that RE ≥ 0.01, and the elastic modulus E'(-40) is 10 MPa or more and less than 1000 MPa. The present method includes a step of bonding the adhesive layer 12 to a back surface of the semiconductor wafer having circuits formed thereon, a step of separating the semiconductor wafer into segments to obtain semiconductor parts, and a pickup step of separating the semiconductor parts from the adhesive layer 12, and includes a step of evaluating the semiconductor wafer or the semiconductor parts prior to the pickup step.