Semiconductor Device Wafer-Level Integration
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Solution Overview
Problem
Conventional semiconductor devices are larger and thicker due to separate packaging of semiconductor dies, which hinders the development of smaller and thinner devices with high reliability.
Innovation Solution
A semiconductor device is manufactured by attaching two substrates with device elements on their front surfaces using an adhesive layer, and then cutting them along a predetermined dicing line to create individual semiconductor dies, integrating the light emitting and receiving elements as a single die before wafer division.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor dies are separately packaged and then assembled, then each die can be independently manufactured and tested, but the final device becomes larger and thicker
Solution Approach 1:
The patent merges multiple semiconductor dies into a single integrated structure by forming them on opposite surfaces of the same substrate. The first die is formed on the front surface and the second die is formed on the back surface, eliminating the need for separate packaging and assembly processes. This integration directly reduces the overall device volume while maintaining the reliability benefits of having multiple independently manufactured and tested die elements.
Solution Approach 2:
The patent transitions from a conventional planar arrangement where dies are placed side-by-side on a single substrate to a three-dimensional configuration utilizing both front and back surfaces of the substrate. This dimensional change allows for more efficient space utilization, reducing the device footprint and thickness while accommodating multiple functional die elements within a compact volume.
2Ease of manufacture
If multiple semiconductor dies are separately packaged on a circuit board, then each die can be independently manufactured, but the assembly process becomes complex and time-consuming
Solution Approach 1:
The patent combines multiple die formation processes into a single integrated manufacturing flow. Both the first die and second die are formed on the same substrate using coordinated processing steps, eliminating the need for separate packaging and assembly operations. This merger of processes simplifies the overall manufacturing procedure and significantly improves production efficiency by reducing the number of discrete steps required.
Solution Approach 2:
The patent performs preliminary actions by forming both dies on the substrate simultaneously during the same manufacturing cycle, rather than manufacturing them separately and assembling them later. This preliminary integration of multiple die elements onto a single substrate before final device completion streamlines the manufacturing process and enhances productivity by reducing subsequent assembly operations.
3Reliability
If semiconductor dies are separately packaged with individual sealing, then each die is protected, but the overall device thickness increases
Solution Approach 1:
The patent merges the protection function for multiple dies into a single integrated sealing structure. The substrate itself serves as the protective enclosure for both the first die on the front surface and the second die on the back surface. This unified sealing approach maintains reliable protection for all die elements while eliminating the need for multiple separate sealing layers, thereby reducing the overall device thickness.
Solution Approach 2:
The patent utilizes the substrate's thickness dimension efficiently by placing protected die elements on opposite surfaces. This three-dimensional arrangement allows each die to be enclosed and protected within the substrate structure itself, minimizing the additional thickness required for protective packaging while ensuring reliable protection for all integrated die elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in a smaller, thinner semiconductor device with enhanced reliability and simplified assembly, as the elements are integrated at the wafer level before division into individual devices, reducing subsequent assembly work and manufacturing costs.
Implementation Method 1
a first substrate and a second substrate are attached with the front surfaces facing each other with an adhesive layer being interposed therebetween
Data Source
AI summary
The invention provides a semiconductor device with high reliability and smaller size and a method of manufacturing the same. A light emitting element as a device element is formed on the front surface of a semiconductor substrate, for example. In detail, an N-type semiconductor layer, a P-type semiconductor layer and pad electrodes are formed on the front surface of the semiconductor substrate. A device element receiving light from the light emitting element (e.g. a photodiode element), for example, and pad electrodes are formed on the front surface of another semiconductor substrate. The semiconductor substrates are attached and integrated with an adhesive layer being interposed therebetween. Wiring layers electrically connected to the pad electrodes and wiring layers electrically connected to the other pad electrodes are formed on the side surface of the semiconductor substrate.