Semiconductor Wafer Testing With Contactless Magnetic Coupling
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Solution Overview
Problem
Conventional semiconductor wafer testing methods involve physical contact, leading to increased failure rates, wear, and higher costs due to component replacement, as well as longer measurement times.
Innovation Solution
A semiconductor wafer testing apparatus utilizing contactless wireless communication through magnetic coupling between chip inductors and inductors on the semiconductor device, allowing for non-contact signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical contact testing is used, then signal transmission is achieved, but failure rate increases and component wear occurs
Solution Approach 1:
The patent replaces the mechanical contact-based signal transmission system with a magnetic coupling-based wireless communication system. Chip inductors on the probe card generate magnetic fields that couple with inductors on the semiconductor wafer, enabling signal transmission without physical contact between testing components and the wafer surface.
Solution Approach 2:
The patent introduces magnetic fields as an intermediary medium for signal transmission. The chip inductors and wafer inductors serve as intermediaries that transfer signals through magnetic coupling, eliminating the need for direct mechanical contact between the probe card and wafer.
2Productivity
If physical contact testing is used, then signal transmission is achieved, but measurement time increases
Solution Approach 1:
The patent replaces the mechanical contact-based testing system with a wireless magnetic coupling system, eliminating the time required for physical contact establishment and reducing measurement cycles while improving reliability through contactless operation.
3Reliability
If contactless wireless communication is used, then failure rate reduces and measurement time shortens, but system complexity increases
Solution Approach 1:
The patent makes the probe card universally applicable by integrating chip inductors that enable wireless communication functionality. The same probe card structure serves both traditional testing purposes and contactless wireless signal transmission, reducing the need for separate specialized equipment.
Solution Approach 2:
The patent changes the operational parameters of the testing system by introducing magnetic coupling mechanisms and wireless signal transmission protocols, allowing the system to operate in both contact-based and contactless modes with adjusted frequency and coupling parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces failure rates, lowers component replacement costs, and shortens measurement time while enabling high-speed signal testing with a stable and cost-effective system.
Implementation Method 1
transmitting a signal to a plurality of first coils by magnetically coupling the plurality of first coils to a plurality of second coils
Data Source
AI summary
A semiconductor wafer testing apparatus includes a stage configured to place a semiconductor wafer having a plurality of first coils, a probe card configured to hold a plurality of chip inductors having a plurality of second coils, a driver configured to move the probe card toward the stage, and a control circuit including a plurality of transmitting circuits or a plurality of receiving circuits connected to each of the plurality of chip inductors. The control circuit is configured to transmit signals to the plurality of first coils by magnetically coupling the plurality of first coils to each of the plurality of second coils.