Semiconductor Wafer Pad Design for Compact Measurement

Solution Overview

Problem

Existing semiconductor devices and wafers face challenges in reducing size due to the need for additional pads and needle marks for characterizing semiconductor elements, which increase chip size and complexity.

Innovation Solution

The semiconductor device and wafer design includes a substrate with through holes connecting electrodes to a metal layer, alternately arranged second electrodes, and a protective film exposing specific pads while covering first electrodes, allowing for reduced size without needle marks on the electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If additional pads and needle marks are provided for characterizing semiconductor elements, then measurement capability is improved, but device size and complexity increase

Engineering Contradiction:

Improvemeasurement capabilityVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The first pad is designed to serve dual purposes: it functions as an electrical connection terminal for the semiconductor element and simultaneously serves as a measurement target for characterizing the element. This multi-functionality eliminates the need for separate dedicated measurement pads, thereby improving measurement capability while avoiding increased device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the electrical connection function and the measurement function into a single integrated structure (the first pad). By combining these two functions that were previously separate, the device achieves measurement capability without adding additional pads or increasing overall complexity

Inventive Principle:

Principle #5Merging (Combining)

2Measurement precision

If additional pads and needle marks are provided for characterizing semiconductor elements, then measurement capability is improved, but chip size increases

Engineering Contradiction:

Improvemeasurement capabilityVSAvoidchip size

Core Design Contradiction:

Measurement precisionVSArea of moving object

Solution Approach 1:

The first pad is designed to serve dual purposes: it functions as an electrical connection terminal for the semiconductor element and simultaneously serves as a measurement target for characterizing the element. This multi-functionality eliminates the need for separate dedicated measurement pads, thereby improving measurement capability while avoiding increased chip size

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the electrical connection function and the measurement function into a single integrated structure (the first pad). By combining these two functions that were previously separate, the device achieves measurement capability without adding additional pads or increasing chip size

Inventive Principle:

Principle #5Merging (Combining)

3Ease of operation

If source fingers are widened or additional wirings are provided for measurement, then measurement access is improved, but parasitic capacitance increases

Engineering Contradiction:

Improvemeasurement accessVSAvoidparasitic capacitance

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The invention extracts the measurement function from the traditional measurement approach (which required widened source fingers or additional wirings) and integrates it into the existing first pad structure. This extraction allows measurement access to be achieved without modifying the source finger dimensions or adding wirings, thereby avoiding increased parasitic capacitance

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The first pad serves as an intermediary structure that provides measurement access without requiring direct contact with or modification of the source fingers. By using the pad as an intermediate access point, the invention enables measurement while maintaining the original source finger geometry and minimizing parasitic capacitance

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20230051546A1Semiconductor device and wafer

Publication Date: 2023.02.16 SUMITOMO ELECTRIC DEVICE INNOVATIONS

AI summary

A semiconductor device includes a substrate having an upper surface and a lower surface, a metal layer provided on the lower surface of the substrate, a semiconductor element including first electrodes provided on the upper surface of the substrate, connected to the metal layer via through holes penetrating the substrate, and electrically separated from each other on the upper surface of the substrate, second electrodes provided on the upper surface of the substrate and alternately provided with the first electrodes, and a first pad provided on the upper surface of the substrate and to which the second electrodes are connected, and a protective film provided on the upper surface of the substrate to cover the first electrodes and the second electrodes, having a first opening that exposes at least a part of the first pad, and having no opening that overlaps the first electrodes.