Process Control System for Semiconductor Wafer Recipe Adjustment
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Solution Overview
Problem
Conventional semiconductor manufacturing process control techniques face challenges in performing process control from one wafer to another and cannot effectively handle consecutive process steps, leading to inefficiencies and reduced production capacity.
Innovation Solution
A method is introduced where a process control system is inserted between the manufacturing execution system and the manufacturing apparatus, allowing for real-time acquisition and rewriting of process recipes based on previous step results, enabling independent process control and direct communication between the apparatus and the system, which reduces communication burdens and allows for precise control parameter calculation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the MES inquires the process control method before transmitting the recipe, then the process control can be adjusted based on sensor values, but the production capacity is reduced due to the inquiry time period
Solution Approach 1:
The process control system pre-calculates and stores multiple process control methods corresponding to different sensor value ranges before the MES needs to inquire. When the MES transmits the recipe, the process control system has already prepared the appropriate control method, eliminating the inquiry time and enabling immediate application without reducing production capacity.
Solution Approach 2:
The system performs preliminary acquisition of wafer information from the previous process step and pre-calculates the optimal process control method in advance. This allows the MES to transmit the recipe without waiting for an inquiry response, thereby maintaining both high precision process control and high production capacity.
2Manufacturing precision
If the process control is performed from one wafer to another based on wafer information, then the manufacturing precision is improved, but the system complexity increases
Solution Approach 1:
The patent introduces a process control system as an intermediary component between the MES and the manufacturing apparatus. This intermediary system handles the complex tasks of acquiring wafer information, calculating control parameters, and determining optimal process control methods, while the MES and manufacturing apparatus maintain their existing simple structures. The process control system absorbs the complexity, allowing wafer-to-wafer precision control without significantly increasing overall system complexity.
3Productivity
If the MES transmits the recipe to the manufacturing apparatus, then the process can be executed, but the process control cannot be adjusted in real-time for consecutive process steps
Solution Approach 1:
The patent implements a feedback mechanism where the process control system acquires sensor values from the manufacturing apparatus and wafer information from the previous process step. Based on this feedback information, the system calculates and determines the optimal process control method, which is then applied to the recipe transmission. This feedback loop enables real-time adjustment for consecutive process steps while maintaining fast process execution.
Solution Approach 2:
The system uses feedback from sensor values and wafer information to dynamically adjust the process control method for each recipe transmission. The process control system continuously monitors the state and adjusts control parameters in real-time, enabling adaptability for consecutive process steps without sacrificing execution speed, as the adjustments are made automatically based on pre-established control algorithms.
Data Source
AI summary
A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a recipe is change from one wafer to another. The method comprises steps of inserting a process control system into the path of a network where a manufacturing execution system (MES) and a manufacturing apparatus are connected with each other by using a LAN, obtaining a process result on the lot of the wafers at a previous step through the use of the process control system to rewrite the process recipe, and transmitting the rewritten process recipe from the process control system to the manufacturing apparatus. Since the method includes the step of obtaining the process result on the lot effected at the previous step as wafer information, it is possible to calculate a control parameter taking account of the state of the wafers. Also, since a process control (APC) system is inserted between the MES and the apparatus, there is no communication between the MES and the APC system, so that a communication burden is reduced, thereby the process control can be performed from one wafer to another.