Semiconductor Wafer Segmented Gap Structure for Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packaging processes are inefficient and yield-limited due to the need for large gaps between dies and precise alignment in chip-to-wafer or wafer-to-wafer bonding, which slows down miniaturization and increases the risk of contamination and misalignment.
Innovation Solution
A method involving a semiconductor wafer with array and die regions, where the first gap between array regions is greater than the second gap between die regions, allowing for electrical connection of dies on an array chip to a wafer, followed by an underfill layer covering specific sidewalls, enabling faster and more efficient dicing into package structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If large gaps are maintained between dies for precise alignment in chip-to-wafer or wafer-to-wafer bonding, then alignment precision is improved, but packaging process speed deteriorates and productivity decreases
Solution Approach 1:
The wafer is divided into array regions and die regions with different gap requirements. The first gap between array regions is larger to accommodate packaging processes, while the second gap between die regions is smaller to enable closer die placement. This segmentation allows different gap sizes in different areas, resolving the contradiction between alignment precision and packaging speed.
Solution Approach 2:
Different gap sizes are applied locally to different regions of the wafer. The array regions have larger gaps (first gap) suitable for packaging operations, while die regions have smaller gaps (second gap) suitable for high-density die placement. This local differentiation allows each region to optimize for its specific function, improving both alignment precision and packaging productivity.
2Manufacturing precision
If large gaps are maintained between dies, then alignment precision is improved, but space requirements increase and miniaturization is hindered
Solution Approach 1:
The wafer layout is segmented into array regions with larger gaps and die regions with smaller gaps. This allows the overall structure to maintain sufficient spacing for alignment while enabling compact die placement within die regions, thus reducing total space requirements and supporting miniaturization while preserving alignment precision.
Solution Approach 2:
Different gap dimensions are assigned to different functional regions: array regions use larger first gaps for alignment tolerance, while die regions use smaller second gaps for space efficiency. This local quality differentiation resolves the contradiction by allowing precise alignment where needed while minimizing space consumption in die placement areas.
3Manufacturing precision
If precise alignment is enforced in wafer bonding, then manufacturing precision is improved, but the risk of contamination and misalignment increases
Solution Approach 1:
The bonding process is segmented into stages corresponding to different gap regions. The larger first gap between array regions provides a buffer zone that reduces the risk of contamination during alignment operations, while the smaller second gap between die regions enables precise final positioning. This segmented approach allows alignment precision to be achieved without excessive contamination risk.
4Manufacturing precision
If conventional packaging processes are used with large gaps between dies, then alignment is improved, but process efficiency deteriorates
Solution Approach 1:
The packaging process benefits from the segmented gap structure: larger first gaps facilitate easier alignment operations, while smaller second gaps enable higher die density and faster processing. This segmentation allows the process to achieve both good alignment and high efficiency by optimizing gap sizes for different process stages and regions.
Solution Approach 2:
Different gap sizes are optimized for different local requirements: array regions have larger gaps suitable for packaging process efficiency, while die regions have smaller gaps suitable for high-density integration. This local optimization resolves the contradiction between alignment precision and process efficiency by matching gap dimensions to functional requirements.
Data Source
AI summary
The present invention provides a method of manufacturing a package structure. An array chip including a plurality of first dies is provided. A wafer including a plurality of second dies is provided. A package step is carried out to package the array chip onto the wafer so as to electrically connect the first die and the second die. The present invention further provides a semiconductor wafer and a package structure.