Semiconductor Package Warpage Reduction via Conductive Substrate

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Solution Overview

Problem

Semiconductor wafer thinning can lead to warpage and increased thickness due to wire bonding, which complicates the manufacturing process and may result in unusable devices.

Innovation Solution

A method involving a conductive metal substrate with electrode pads and inductive coils, where semiconductor dies are electrically coupled to contact pads without wire bonding, and the substrate is removed after encapsulation in a molding material to reduce warpage and thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If wafer thinning is performed to reduce semiconductor die thickness, then the thickness of the semiconductor die is reduced, but warpage occurs leading to unusable devices

Engineering Contradiction:

Improvethickness of semiconductor dieVSAvoidwarpage of silicon wafer

Core Design Contradiction:

Length of moving objectVSStability of the object's composition

Solution Approach 1:

A carrier substrate is introduced as an intermediary component to support the thinned semiconductor die during processing and packaging. The carrier substrate provides mechanical stability and prevents warpage while allowing the die to maintain its reduced thickness, thus resolving the contradiction between thinning the die and preventing warpage.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If wire bonding is used to connect contact pads to leads, then electrical connection is achieved, but the packaging process becomes time consuming and thickness increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidpackaging process time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The wire bonding step is extracted and eliminated from the packaging process. Instead, the patent uses direct electrical connections through the carrier substrate architecture, where contact pads are electrically connected to leads through conductive structures integrated into the carrier substrate, thereby removing the time-consuming wire bonding operation while maintaining reliable electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If wire bonding is used to connect contact pads to leads, then electrical connection is achieved, but impedance in the electrical circuit increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidimpedance in electrical circuit

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The mechanical wire bonding system is replaced with an integrated conductive structure system. The carrier substrate incorporates conductive traces and pathways that provide direct electrical connections between contact pads and leads, eliminating the mechanical wire bonds and their associated impedance issues, thereby reducing circuit impedance while maintaining reliable electrical connection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS8987054B2Semiconductor devices and methods of making the same

Publication Date: 2015.03.24 SEMICON COMPONENTS IND LLC

AI summary

In one embodiment, methods for making semiconductor devices are disclosed.