Semiconductor Device Warpage Suppression via Mold Release Agent
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices with flip-chip mounting experience warpage due to thermal contraction of sealing resins, leading to potential chip cracking, and existing solutions either increase costs, reduce chip strength, or limit resin selection based on linear expansion coefficients.
Innovation Solution
A semiconductor device design that includes a gap between the fillet-shaped sealing resin and the semiconductor chips, achieved by applying a mold release agent to the chip surfaces or using a partition plate that is removed after resin application, preventing resin adhesion and thus reducing stress from thermal contraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing resin is uniformly applied to upper surface of lower chip and side surface of upper chip, then bump is protected, but warpage occurs due to thermal contraction stress
Solution Approach 1:
The sealing resin application area is segmented into two distinct zones: a first area on the lower chip upper surface and a second area on the upper chip side surface. The first area has larger area than the second area, creating a stepped configuration that reduces thermal contraction stress concentration and prevents warpage while maintaining bump protection.
Solution Approach 2:
Different regions of the sealing resin application are given different properties: the first area on the lower chip has larger area for stress distribution, while the second area on the upper chip has smaller area. This local differentiation in area distribution optimizes both protection and warpage prevention.
2Manufacturing precision
If sunken portion is provided on lower chip to prevent resin protrusion, then resin containment is improved, but manufacturing cost increases
Solution Approach 1:
Instead of creating a sunken portion on the lower chip to contain the resin, the invention inverts the approach by creating a stepped configuration where the sealing resin naturally forms a fillet shape with the first area larger than the second area. This eliminates the need for costly sunken portion fabrication while achieving the same resin containment effect.
3Shape
If groove is provided on lower substrate to reduce warpage, then warpage is reduced, but chip strength decreases when chip is made thinner
Solution Approach 1:
The sealing resin area is segmented into a first area and a second area with different sizes, creating a stepped configuration that reduces warpage through stress distribution without requiring grooves or sunken portions that would compromise chip structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses warpage and chip cracking without increasing costs or reducing chip strength, allowing for flexible resin selection and maintaining chip reliability.
Implementation Method 1
applying a mold release agent to the chip surfaces or using a partition plate that is removed after resin application, preventing resin adhesion
Implementation Method 2
applying a mold release agent to the chip surfaces or using a partition plate that is removed after resin application, preventing resin adhesion
Implementation Method 3
The underfill material fills the interval between the circuit substrate and the semiconductor chip by using a capillary phenomenon
Data Source
AI summary
The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device capable of suppressing warpage of the semiconductor device. A mold release agent 101 is applied to a side surface of an upper chip 11. According to this, when a sealing resin 31 for protecting a bump 21 is applied, the bump 21 between the upper chip 11 and a lower chip 12 is protected and a fillet-shaped protruding portion does not adhere to the side surface of the upper chip 11 due to the mold release agent 101, so that a gap 111 is formed. According to this, a stress to warp the lower chip 12 is not generated even when contraction associated with drying of the sealing resin 31 between the side surface of the upper chip 11 and an upper surface of the lower chip 12 occurs, so that it becomes possible to suppress the warpage. The present technology may be applied to the semiconductor device.