Semiconductor Package Warpage Control via Segmented Metal Ring
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Solution Overview
Problem
Conventional semiconductor structures with metal rings face issues of warpage due to mismatched coefficients of thermal expansion (CTE) between metal and dielectric layers, leading to potential delamination and manufacturing inefficiencies.
Innovation Solution
A semiconductor structure with a metal ring having two portions, where the first portion is secured to the substrate with a lower CTE and the second portion has a higher CTE, designed to reduce warpage and delamination risks by managing thermal deformation effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the metal ring is made of aluminum to reduce substrate warpage, then the warpage of the substrate is effectively reduced, but the CTE of aluminum is rather large and the deformation degree of aluminum is relatively high, thus potentially leading to delamination of the metal ring from the substrate
Solution Approach 1:
The metal ring is divided into two distinct portions: a first metal ring portion made of aluminum and a second metal ring portion made of copper. This segmentation allows each portion to have different CTE properties tailored to their specific functions, resolving the contradiction between warpage reduction and delamination prevention.
Solution Approach 2:
Different portions of the metal ring are assigned different material qualities based on their functional requirements. The first portion (aluminum) has high CTE for warpage control, while the second portion (copper) has low CTE for delamination prevention. This local differentiation of material properties resolves the contradiction.
2Reliability
If the metal ring is made of copper to prevent delamination, then the CTE of copper is rather small and the deformation degree of copper is relatively low, but the substrate is still subject to warpage and so is the metal ring
Solution Approach 1:
The metal ring is segmented into two portions with different materials. The first portion (aluminum) provides the necessary deformation capability to counteract substrate warpage, while the second portion (copper) provides delamination resistance. This segmentation allows both contradictory requirements to be satisfied simultaneously.
Solution Approach 2:
The metal ring is constructed as a composite structure combining aluminum and copper portions. This composite design integrates the advantageous properties of both materials: aluminum's high CTE for warpage management and copper's low CTE for delamination prevention, resolving the contradiction between these two performance requirements.
3Device complexity
If a single-material metal ring is used, then the structure is simple, but it cannot simultaneously achieve both warpage reduction and delamination prevention
Solution Approach 1:
Rather than using a single uniform material, the metal ring is segmented into two portions with different materials. This segmentation increases material functionality while maintaining relatively simple structural geometry, achieving a balance between complexity and performance.
Solution Approach 2:
The metal ring employs a composite material structure combining aluminum and copper. This composite approach enhances overall reliability by leveraging the complementary properties of both materials, while the design maintains simplicity in terms of manufacturing process and geometric configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces substrate warpage, increases yield rates, and lowers manufacturing costs by minimizing delamination and enhancing thermal management.
Implementation Method 1
The first portion of the ring is located on the first surface of the substrate and has a first coefficient of thermal expansion (CTE). The second portion of the ring is located on the first portion of the ring and has a second CTE, and the second CTE is greater than the first CTE.
Data Source
AI summary
A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.