Semiconductor Examination Waveform Separation With Overlapping Beam Spots
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Solution Overview
Problem
The miniaturization of semiconductor apparatuses leads to beam spots that straddle multiple drive elements, causing interference in detection signals, which complicates accurate examination using optical probing techniques.
Innovation Solution
A method and apparatus that acquire and separate interference waveforms from multiple drive elements using overlapping light spots, allowing for precise waveform signal separation based on positional influence, and perform noise removal and alignment with layout images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the light beam spot is made smaller to improve spatial resolution, then the examination precision is improved, but the beam spot may still straddle multiple drive elements causing interference in the detection signal
Solution Approach 1:
The patent divides the examination area into multiple overlapping spots, where each spot is designed to primarily illuminate a specific drive element while partially overlapping with adjacent spots. This segmentation allows the system to collect interference waveforms from multiple spots and mathematically separate the signals from individual drive elements, thereby achieving precise examination without signal interference.
Solution Approach 2:
The patent introduces an intermediary mathematical processing step that acts as a mediator between the raw detection signals and the final examination results. By using the overlapping spot configurations as intermediaries, the system can isolate and separate the waveform signals from each drive element through computational methods, eliminating the harmful interference effects while maintaining spatial resolution.
2Adaptability or versatility
If the beam spot straddles multiple drive elements to maintain coverage, then the examination coverage is improved, but interference occurs in the detection signal reducing examination accuracy
Solution Approach 1:
The patent merges the examination coverage benefit with signal separation capability by deliberately designing overlapping spot configurations. Multiple spots are combined to cover the entire semiconductor apparatus, and the interference waveforms from these merged spots are processed together to separate and identify individual drive element signals, thereby achieving both comprehensive coverage and high accuracy.
Solution Approach 2:
The patent employs feedback through iterative processing where the system analyzes the interference waveforms, identifies the drive element signals, and uses this information to refine the examination process. The separation results are fed back to improve the overall examination accuracy, allowing the system to maintain coverage while eliminating interference effects.
3Adaptability or versatility
If interference waveforms are used to examine multiple drive elements, then the examination coverage is improved, but the complexity of signal processing increases
Solution Approach 1:
The patent transitions from a single-dimensional signal analysis to a multi-dimensional approach by utilizing the temporal and spatial dimensions of the interference waveforms. By analyzing waveforms across multiple overlapping spots and their temporal characteristics, the system can separate drive element signals without requiring complex processing for each individual element, thereby managing complexity while expanding coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the accuracy of semiconductor apparatus examination by clearly distinguishing drive element waveforms, facilitating identification of failure locations and improving alignment with layout images.
Implementation Method 1
reflected light reflected by the semiconductor apparatus is detected by an optical sensor
Data Source
AI summary
A semiconductor apparatus examination method includes a step of acquiring a first interference waveform based on signals from a plurality of drive elements according to light from a first light beam spot including the plurality of drive elements in a semiconductor apparatus, a step of acquiring a second interference waveform based on signals from the plurality of drive elements according to light from a second light beam spot having a region configured to partially overlap the first spot and including the plurality of drive elements, and a step of separating a waveform signal for each of the drive elements in the first and second spots based on the first and second interference waveforms.