Semiconductor Package Waveguides for Multi-Frequency Signal Propagation
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Solution Overview
Problem
Integrated optical waveguides in semiconductor structures face challenges in efficiently guiding electromagnetic signals with different frequencies due to variations in dielectric constants and thicknesses, which affects their ability to support high-speed data transmission for applications like 5G communication and high-performance computing.
Innovation Solution
The semiconductor structure employs multiple dielectric waveguides with varying dielectric constants and thicknesses, spatially separated by inter-level dielectric layers, coupled with transmitter and receiver structures to propagate signals efficiently across different frequency bands, enabling wide bandwidth transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single dielectric waveguide is used, then the structure is simple, but it cannot efficiently guide electromagnetic signals with different frequencies
Solution Approach 1:
The patent divides the waveguide system into multiple separate dielectric waveguides, each optimized for specific frequency ranges. This segmentation allows each waveguide to handle particular frequency bands efficiently while the collective system supports a broad spectrum, resolving the contradiction between versatility and complexity.
Solution Approach 2:
The patent transitions from a single-plane waveguide to a three-dimensional stacked configuration with multiple dielectric layers. This dimensional change enables frequency-based spatial separation where different waveguides operate at different vertical levels, achieving broad frequency support without excessive planar complexity.
2Reliability
If waveguides with higher dielectric constants are used, then lower frequency transmission is optimized, but manufacturing precision requirements increase
Solution Approach 1:
The patent systematically varies dielectric constant values across different layers (e.g., TiO2 with k=80, Ta2O5 with k=25, SiO2 with k=4) to optimize performance for different frequency ranges. This parameter optimization balances transmission quality with manufacturability by selecting materials that provide adequate performance margins.
Solution Approach 2:
Different dielectric materials with specific properties are assigned to specific layers based on their optimal frequency ranges. Lower frequency waveguides use high-dielectric-constant materials, while upper layers use lower-dielectric-constant materials, creating localized optimization that maintains overall system reliability without uniformly increasing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high-speed data transmission with wider bandwidth, suitable for 5G, high-performance computing, and artificial intelligence applications, while optimizing manufacturing costs by using waveguides with higher dielectric constants for lower frequency transmissions.
Implementation Method 1
Integrated optical waveguides are used to confine and guide light from a first point on an integrated chip (IC) to a second point on the IC with minimal attenuation. Generally, integrated optical waveguides provide functionality for signals imposed on optical wavelengths in the visible spectrum.
Implementation Method 2
The semiconductor structure employs multiple dielectric waveguides with varying dielectric constants and thicknesses, spatially separated by inter-level dielectric layers, coupled with transmitter and receiver structures to propagate signals efficiently across different frequency bands
Data Source
AI summary
A package structure including a wiring substrate, an interposer and a semiconductor die is provided. The interposer is disposed on and electrically connected to the wiring substrate, and the interposer includes an embedded dielectric waveguide. The semiconductor die is disposed on and electrically connected to the interposer. In some embodiments, the interposer includes a semiconductor substrate; dielectric layers stacked on the semiconductor substrate; and conductive wirings disposed on and electrically connected to the semiconductor substrate, wherein the conductive wirings and the embedded dielectric waveguide are embedded in the dielectric layers.