Semiconductor Package Waveguide Structure for Multi-Die Optical Coupling
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Solution Overview
Problem
Current photonic integrated circuits (PICs) face limitations in optical communication due to restricted package structures, which hinder efficient optical transmission between photonic dies.
Innovation Solution
A semiconductor package manufacturing method that includes forming wave guide patterns on a substrate, encapsulating photonic dies with an encapsulant, and creating a wave guide structure using polymer layers to optically couple adjacent photonic dies, thereby enabling extended optical communication beyond the confines of unsingulated photonic dies within a semiconductor wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional package structures are used for photonic integrated circuits, then manufacturing simplicity is maintained, but optical communication capability is limited
Solution Approach 1:
The photonic die is segmented into multiple functional regions including active device regions, passive device regions, and waveguide regions. This segmentation allows each region to be optimized for its specific function while collectively enabling extended optical communication capabilities beyond traditional package structures
Solution Approach 2:
The invention extends optical communication from traditional planar two-dimensional coupling to three-dimensional spatial coupling by implementing waveguides that propagate light in multiple dimensions, allowing optical signals to traverse through the package structure in vertical and lateral directions simultaneously
2Reliability
If photonic dies are singulated individually, then device independence is achieved, but optical transmission efficiency is reduced
Solution Approach 1:
Multiple photonic dies are combined into a single integrated photonic die structure, eliminating the need for individual singulation. The merged structure maintains device independence through distinct functional regions while achieving superior optical transmission efficiency through continuous waveguide propagation across the entire integrated structure
3Loss of energy
If wave guide structure is extended over reconstructed wafer, then optical signal loss is reduced, but manufacturing complexity increases
Solution Approach 1:
Waveguide patterns are formed on the substrate before photonic die attachment, and encapsulant is applied to define regions before waveguide structure completion. These preliminary actions establish the optical pathway framework in advance, reducing subsequent manufacturing complexity while achieving low optical signal loss through continuous waveguide propagation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described method allows for enhanced optical communication between photonic dies by extending the wave guide structure over the reconstructed wafer, reducing optical signal loss, and integrating photonic dies and wave guide structures within a single package, thus overcoming the limitations of traditional package structures.
Implementation Method 1
a wave guide structure that lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer to be optically coupled to the wave guide pattern
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.