Semiconductor Module Well Layout for Easier Sensor Assembly
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Solution Overview
Problem
Semiconductor devices face challenges in assembly and manufacturing cost due to complex configurations and the need for precise placement of sensors and electrodes, which can lead to increased costs and reduced efficiency.
Innovation Solution
A semiconductor device design featuring well regions and protective layers that simplify the assembly process by reducing the need for precise placement of current sensors and temperature sensors, while maintaining the performance and withstand capability of the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex configurations with precise placement of sensors and electrodes are used, then device performance and reliability are improved, but assembly difficulty and manufacturing cost increase
Solution Approach 1:
The patent combines multiple functional elements (current sensor, temperature sensor, and electrode) into a single integrated sensor electrode structure. This merging eliminates the need for separate placement of multiple components, thereby reducing assembly complexity while maintaining the sensing and electrical functions required for device performance and reliability.
Solution Approach 2:
The sensor electrode is designed to perform multiple functions simultaneously: it serves as both an electrical electrode and as a sensor element for detecting current and temperature. This multi-functionality reduces the total number of components needed and simplifies the overall device configuration, addressing the contradiction between performance requirements and assembly complexity.
2Reliability
If complex configurations with precise placement of sensors and electrodes are used, then device performance and reliability are improved, but manufacturing cost increases
Solution Approach 1:
By merging the sensor and electrode into a single integrated structure, the patent reduces the number of discrete components that need to be manufactured, stored, and assembled. This consolidation simplifies the manufacturing process, reduces material costs, and eliminates the need for precise alignment operations, thereby lowering overall manufacturing cost while maintaining device performance.
Solution Approach 2:
The patent extracts the sensing function from separate sensor components and integrates it directly into the electrode structure. This extraction and integration eliminates the need for separate sensor manufacturing and placement processes, reducing manufacturing complexity and cost while preserving the necessary sensing capabilities for device performance.
3Measurement precision
If precise placement of sensors and electrodes is required, then measurement precision is improved, but assembly time and productivity decrease
Solution Approach 1:
The integration of sensor and electrode into a single component eliminates the need for separate placement operations. This merging allows the component to be placed in a single operation without requiring precise alignment between multiple separate elements, thereby maintaining measurement precision while significantly improving assembly efficiency and productivity.
Data Source
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AI summary
Provided is a semiconductor device including: a semiconductor substrate; an active portion provided on the semiconductor substrate; a first well region and a second well region arranged sandwiching the active portion in a top view, provided on the semiconductor substrate; an emitter electrode arranged above the active portion; and a pad arranged above the first well region, away from the emitter electrode, wherein the emitter electrode is provided above the second well region. The provided semiconductor device further includes a peripheral well region arranged enclosing the active portion in a top view, wherein the first well region and the second well region may protrude to the center side of the active portion rather than the peripheral well region.