Semiconductor Package Wilkinson Divider Signal Distribution
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Solution Overview
Problem
There is a demand for large-capacity and multi-functional semiconductor chips that require efficient signal distribution and impedance matching in semiconductor packages, which existing technologies struggle to achieve due to limitations in signal transfer and power consumption.
Innovation Solution
The semiconductor package incorporates a printed circuit board with a Wilkinson divider structure, including a signal transfer line, first and second transfer lines, and a resistor circuit, which connects external connection terminals to semiconductor chips, ensuring efficient signal distribution and impedance matching, thereby reducing power consumption and improving isolation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional signal transfer methods are used in semiconductor packages, then device complexity is reduced, but signal distribution efficiency and impedance matching deteriorate
Solution Approach 1:
The patent introduces a Wilkinson divider circuit as an intermediary component between the signal source and multiple semiconductor chips. This circuit includes resistors (R1, R2, R3) and transmission lines (T1, T2, T3) that act as mediators to achieve proper signal distribution and impedance matching. The resistor R3 connected between the two output branches serves as a mediator to isolate signal reflections and improve isolation between channels while maintaining 50-ohm impedance matching throughout the system.
Solution Approach 2:
The patent applies parameter changes by carefully selecting specific resistance values (R1=R2=50Ω, R3=100Ω) and transmission line characteristics to achieve optimal impedance matching. The transmission lines are designed with specific lengths (quarter-wavelength at operating frequency) and characteristic impedances (70.7Ω for T1 and T2) to transform and match impedances between different stages of the signal distribution network, thereby improving signal distribution efficiency.
2Reliability
If signal power is increased to improve distribution to multiple chips, then signal strength improves, but power consumption increases
Solution Approach 1:
The Wilkinson divider circuit acts as an intermediary that efficiently divides signal power between multiple channels without excessive loss. The resistor R3 serves as a mediator that absorbs reflected power and prevents it from returning to the source, thereby improving power transfer efficiency. This allows adequate signal strength to reach multiple semiconductor chips while minimizing overall power consumption compared to simpler distribution methods.
Solution Approach 2:
The patent converts the potentially harmful effect of signal reflections into a beneficial feature. By placing resistor R3 between the two output branches, reflected signals from mismatched loads are absorbed by R3 rather than returning to contaminate the source or the other channel. This converts the harmful reflection into a controlled energy dissipation path, improving overall signal integrity and power efficiency.
3Reliability
If simple transfer lines are used between pads and chips, then device complexity is reduced, but isolation characteristics between chips deteriorate
Solution Approach 1:
The Wilkinson divider circuit serves as an intermediary structure between the input pad and the two output pads/chips. The resistor R3 acts as a mediator that provides isolation between the two output channels. When one channel experiences signal reflections or interference, R3 prevents these effects from coupling into the other channel, thereby achieving excellent isolation characteristics (typically >20dB) while maintaining a relatively simple overall package structure.
Data Source
AI summary
A semiconductor package includes a printed circuit board, a resistor circuit, and first and second semiconductor chips. First and second pads are on a first surface of the printed circuit board, and external connection terminal is on a second surface of the printed circuit board. The resistor circuit has a first connection terminal connected to the first pad and a second connection terminal connected to the second pad. The first semiconductor chip is connected to the first pad and the second semiconductor chip is stacked on the first semiconductor chip and connected to the second pad. The printed circuit board includes a signal transfer line connecting a branch in the printed circuit board to the external connection terminal. A first transfer line connects the branch to the first pad. A second transfer line connects the branch to the second pad.