Compact Semiconductor Stack Using Winding Pressure
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Solution Overview
Problem
Existing semiconductor device structures, such as those described in JP 2004-335777 A, require stud bolts to maintain axial pressure, resulting in a large and cumbersome stack due to the inability to remove these bolts while maintaining pressure.
Innovation Solution
A semiconductor device design featuring a stacked unit with coolers and a semiconductor module, where a seal member connects the coolers and a winding member applies and maintains pressure around the stack, allowing for a compact configuration without the need for stud bolts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If stud bolts are used to maintain axial pressure in the stacked body, then pressure is maintained, but the stack size increases and becomes cumbersome
Solution Approach 1:
The invention extracts and eliminates the stud bolts from the stacked body structure. By removing these protruding fastening components, the stack size is reduced and the structure becomes more compact, while pressure maintenance is achieved through alternative means (the pressure maintaining structure integrated into the stacked body)
Solution Approach 2:
The invention merges the pressure maintaining function directly into the stacked body structure itself, rather than using separate external fastening components. The pressure maintaining structure is integrated with the cooler and semiconductor module assembly, combining structural support and pressure maintenance into a unified compact design
2Stress or pressure
If multiple stud bolts are used to connect pressure support plates, then pressure is maintained, but device complexity increases
Solution Approach 1:
The invention removes the multiple stud bolts and separate pressure support plates from the structure, reducing the number of components and simplifying the overall device complexity while maintaining the essential pressure maintenance function through the integrated pressure maintaining structure
Solution Approach 2:
The stacked body structure is designed to serve multiple functions simultaneously: it provides structural support, maintains pressure on the semiconductor module, and enables coolant flow. This multi-functionality eliminates the need for separate dedicated pressure maintenance components, thereby reducing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a smaller semiconductor device form factor while maintaining pressure in the stacking direction, ensuring effective heat management through coolant flow paths and stable positioning of components.
Implementation Method 1
a winding member keeping pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit
Implementation Method 2
a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler having a second opening and a second coolant flow path that is connected to the second opening
Data Source
AI summary
A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.