Semiconductor Winding Sensor for High-Accuracy Current Detection
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Solution Overview
Problem
Conventional sensors fail to accurately detect current changes in semiconductor devices without increasing the overall device size significantly.
Innovation Solution
A semiconductor component with a winding wire part and a winding return wire part connected at the terminal end, allowing for accurate current detection without excessive size increase, featuring a configuration where the winding return wire does not pass through the winding wire part, and multiple measurement units that surround the object to be measured.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional sensors are used to detect current changes in semiconductor devices, then the detection function is provided, but the detection accuracy is insufficient and the device size increases excessively
Solution Approach 1:
The winding wire part and winding return wire part are integrated within a single semiconductor layer, with the return wire nested alongside the winding wire rather than passing through it. This nested configuration maximizes the number of turns per unit distance while minimizing the overall sensor volume, thereby improving detection accuracy without excessive size increase
Solution Approach 2:
The patent transitions from conventional three-dimensional coil structures to a planar two-dimensional winding pattern within the semiconductor layer. By arranging the winding wire and return wire in a flat configuration where the return wire does not pass through the winding wire, the design achieves high turn density in a compact area, resolving the contradiction between detection accuracy and device size
2Measurement precision
If the number of turns per unit distance is increased to improve sensitivity, then detection accuracy improves, but the device size increases
Solution Approach 1:
The patent optimizes the local arrangement of the winding wire and return wire within the semiconductor layer. By configuring the return wire to run parallel to and alongside the winding wire rather than through it, the design achieves high local turn density in a compact region, improving sensitivity without requiring excessive sensor area
Solution Approach 2:
The planar configuration allows multiple turns to be packed into a smaller area by utilizing the two-dimensional space efficiently. The winding pattern achieves high turn density per unit area through optimized lateral arrangement rather than vertical stacking, thereby improving detection sensitivity without excessive area increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy current detection with miniaturized size, providing high versatility in monitoring semiconductor device operations.
Implementation Method 1
a current detection sensor using a Rogowski coil has been known. The Rogowski coil is a coreless coil, and has a winding core, a winding wire wound around the winding core, and a return wire connected to the terminal end part of the winding wire and returning to a starting end part side
Data Source
AI summary
A semiconductor component 150 has a semiconductor layer 1 including a winding wire part 10 and a winding return wire part 50 connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side, wherein the semiconductor component is disposed so as to surround an object to be measured.