Semiconductor Wire Bonding with Folded Support Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices face challenges in achieving stable bonding and efficient heat dissipation due to the thinness of electrodes and step differences, leading to potential damage and reduced heat dissipation efficiency.
Innovation Solution
A semiconductor device design featuring a first wire with a ball portion bonded to an electrode, a folded portion extended and folded back, and a flat portion bonded onto the ball portion, with a second wire bonded onto the flat portion, creating a space over the peripheral portion of the ball to enhance bonding reliability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wedge bonding is performed directly on the electrode of a semiconductor element, then bonding can be achieved, but stable bonding cannot be obtained due to the thinned thickness of the electrode
Solution Approach 1:
A support structure is introduced as an intermediary component between the wire and the thinned electrode. This support structure provides a robust bonding surface that replaces the insufficient thinned electrode, enabling stable wedge bonding without relying on the weakened electrode material.
Solution Approach 2:
The support structure is positioned and prepared in advance before the wire bonding process. By pre-establishing the support structure at the bonding location, the system ensures that the electrode's thinned condition does not compromise the subsequent bonding operation.
2Reliability
If wedge bonding is performed onto the surface of an electrode with lower height, then bonding can be achieved, but the surface of the step difference of the semiconductor element may be damaged by the tip portion of the capillary
Solution Approach 1:
The support structure serves as a mediator that elevates the bonding surface to a height compatible with the capillary tip. This intermediary platform allows the capillary to perform wedge bonding without its tip contacting and damaging the underlying step difference surface of the semiconductor element.
3Strength
If ball bonding is performed on the wedge-bonded portion, then wire bonding strength is enhanced, but the distance between the wedge bonding portion of the wire and the surface of the semiconductor element becomes small and heat dissipation efficiency decreases
Solution Approach 1:
The support structure introduces a vertical dimension (height) to the bonding configuration. By elevating the bonding interface above the semiconductor element surface, the system simultaneously achieves strong wire bonding while maintaining adequate vertical spacing for heat dissipation, thus resolving the contradiction between bonding strength and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves sufficient bonding reliability and efficient heat dissipation by maintaining a space between the wires and the ball portion, reducing stress on the wires and preventing disconnection, while allowing for effective thermal dissipation of heat generated by the semiconductor element.
Implementation Method 1
a first wire ball-bonded onto the electrode, in which, the first wire has a ball portion bonded onto the electrode
Implementation Method 2
The folded portion of the first wire and the ball portion, or the second wire and the ball portion define a space at a location over a peripheral portion on the ball portion of the first wire
Data Source
AI summary
Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.