Semiconductor Module Wire Layout for Lower Bonding Heat
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Solution Overview
Problem
Existing semiconductor modules face reliability issues due to temperature rise in bonding portions caused by transistor and diode operation, which can be exacerbated by current crowding and restricted wire direction, leading to reduced performance.
Innovation Solution
The arrangement of bonding portions is optimized by angling them relative to the transistor and diode directions, allowing overlap and balanced current distribution, while minimizing temperature rise and avoiding wire direction restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If bonding portions are arranged parallel to transistor and diode directions, then wire connection is simplified, but current crowding occurs and temperature rise increases
Solution Approach 1:
The bonding portions are arranged at an angle of 45 degrees relative to the transistor and diode directions, breaking the symmetric parallel arrangement. This asymmetric angular arrangement redistributes current flow paths, preventing current crowding at specific bonding portions while maintaining manageable wire connection complexity.
2Temperature
If bonding portions are arranged at an angle to transistor and diode directions, then current distribution is balanced and temperature rise is suppressed, but wire connection complexity increases
Solution Approach 1:
The bonding portions are arranged at a specific angular parameter (45 degrees) relative to the transistor and diode directions. This parameter optimization balances current distribution across bonding portions, suppressing temperature rise while the angular configuration is designed to maintain acceptable wire connection complexity.
3Ease of manufacture
If wire bonding is restricted to specific directions, then manufacturing is simplified, but current crowding and reliability issues occur
Solution Approach 1:
Instead of restricting wire bonding to one-dimensional straight lines parallel to transistor/diode directions, the bonding portions are arranged in a two-dimensional angular pattern (45 degrees). This dimensional change in arrangement allows current to distribute across multiple angular paths, preventing current crowding and improving reliability while maintaining manufacturing feasibility.
Data Source
AI summary
Provided is a semiconductor module including a main circuit portion, a plurality of circuit electrodes, a plurality of main terminals, and a plurality of wires, in each of semiconductor chips, transistor portions and diode portions have a longitudinal side in a second direction, each of semiconductor chips has a plurality of end sides including a gate-side end side, each of the gate-side end sides is arranged facing a same side in a top view, the plurality of main terminals are arranged on a same side in relation to the main circuit portion so as not to sandwich the main circuit portion in a top view, each of the plurality of wires has a bonding portion, and a longitudinal direction of the bonding portion has an angle in relation to the second direction.