Semiconductor Wire Bonding Interface Strength
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Solution Overview
Problem
The existing semiconductor devices face issues with the separation of resin sealers from electrode pads due to weak bonding interfaces, leading to potential long-term reliability concerns and reduced product quality.
Innovation Solution
A semiconductor device design where a conductive member is bonded to multiple positions on an insulating film of a semiconductor chip, with a sealer that minimizes the exposed area not overlapping the conductive member, enhancing the bonding interface strength and reducing separation risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the opening area of the opening formed on the protective film is increased to facilitate wire bonding, then the wire bonding becomes easier, but the resin sealer separates from the electrode pad due to weakness at the bonded interface
Solution Approach 1:
The electrode pad is divided into multiple separate openings in the protective film, allowing the wire to be bonded at multiple discrete positions rather than requiring a single large opening. This segmentation maintains adequate bonding area while reducing the exposed electrode pad area that could cause sealer separation.
Solution Approach 2:
The protective film is configured with different opening areas at different locations - smaller openings positioned where the wire makes contact with the electrode pad, and larger or no openings in areas where the resin sealer contacts the electrode pad. This local differentiation optimizes both wire bonding and sealer adhesion.
2Strength
If one wire is bonded to multiple positions of one electrode pad to increase bonding area, then bonding strength improves, but the exposed electrode pad area increases causing resin sealer separation
Solution Approach 1:
Multiple small openings are distributed across the electrode pad area, with the wire bonded at each opening position. This provides sufficient total bonding area for strong wire attachment while minimizing the continuous exposed electrode pad area that would cause resin sealer separation.
Solution Approach 2:
The wire is configured to extend between multiple openings in the protective film, creating a dimensional arrangement where the wire spans across multiple electrode pad contact points. This multi-position bonding approach distributes bonding strength while controlling exposed area.
Data Source
AI summary
A performance of a semiconductor device is improved. The semiconductor device according to one embodiment includes a wire that is bonded to one bonding surface at a plurality of parts in an opening formed in an insulating film of a semiconductor chip. The semiconductor device includes also a sealer that seals the semiconductor chip and the wire so that the sealer is in contact with the bonding surface. An area of a part of the bonding surface, the part not overlapping the wire, is small.