Semiconductor Module Wire Bonding Reshaping and Separation
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Solution Overview
Problem
Existing methods for connecting terminal conductors to semiconductor modules are complex, inflexible, and result in material waste due to the need for prefabricated components and multiple process steps, limiting the flexibility in choosing terminal positions and increasing production complexity.
Innovation Solution
A method involving a circuit carrier with a metallization layer and an electrically conductive wire, where a bonding device creates a connection between the metallization and the wire, reshapes, and then separates the wire to form a terminal conductor with a free end, allowing for flexible positioning and reduced material waste by using a quasi-continuous wire or prefabricated terminal conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If terminal conductors are prefabricated by stamping and bending, then their shape and position are defined, but manufacturing complexity increases and material waste arises
Solution Approach 1:
The patent applies preliminary action by bonding the wire to the conductor track before shaping and separating it. This reverses the conventional sequence where components are prefabricated first. By bonding first, the wire can be precisely positioned and secured to the conductor track, then shaped and separated to create terminal conductors with defined positions without requiring complex prefabrication processes
Solution Approach 2:
The patent applies segmentation by separating the wire into multiple terminal conductors after bonding. A single continuous wire is bonded to the conductor track, then separated into individual terminal conductors through shaping and cutting processes. This eliminates the need to prefabricate each terminal conductor separately, reducing manufacturing complexity and material waste while maintaining precise position definition
2Ease of manufacture
If terminal conductors are inserted into side walls, then connection is achieved, but conductor tracks must be led near edges and process steps increase
Solution Approach 1:
The patent merges multiple process steps into a unified sequence. Instead of separately inserting prefabricated terminal conductors into side walls and separately bonding them, the invention bonds wires directly to conductor tracks, then shapes and separates them to form terminal conductors in place. This consolidation reduces the number of discrete process steps and eliminates the need to lead conductor tracks near housing edges
3Strength
If spring sleeves are used for terminal conductors, then mechanical connection is achieved, but flexibility in position choice is reduced
Solution Approach 1:
The patent applies dynamics by enabling flexible positioning of terminal conductors through the shaping process. After bonding the wire to the conductor track, the wire can be shaped and separated to create terminal conductors at various positions along the conductor track. This dynamic approach allows position flexibility that is not achievable with fixed spring sleeve positions, while maintaining strong mechanical connections through the bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the connection process, reduces material waste, and enhances flexibility in terminal conductor placement, improving the efficiency and complexity of semiconductor module production.
Implementation Method 1
bonding connection is produced between the metallization and a first section of the wire
Data Source
AI summary
A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of the bonding device, a bonding connection is produced between the metallization and a first section of the wire. A separating location and a second section of the wire, the second section being spaced apart from the separating location, are defined on the wire. The wire is reshaped in the second section. Before or after reshaping, the wire is severed at the separating location, such that a terminal conductor of the semiconductor module is formed from a part of the wire. The terminal conductor is bonded to the metallization and having a free end at the separating location.