Semiconductor Wire Bonding Surface Configuration for Resin Adhesion
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Solution Overview
Problem
The existing semiconductor devices face issues with the peeling off of resin sealers from electrode pads due to weak bonding interfaces, which can lead to long-term reliability concerns and reduced service life, especially when exposed to temperature changes.
Innovation Solution
A semiconductor device design with a specific bonding surface configuration, including a first and second bonding region for the wire and a narrower third region in between, where the wire is bonded to multiple positions on an insulating film-covered semiconductor chip, enhancing the bonding area and reducing the exposed area between wires to improve adhesion and reduce peeling off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the opening area of the protective film is increased to facilitate wire bonding, then the wire bonding becomes easier, but the resin sealer peels off from the electrode pad due to weak bonding interface
Solution Approach 1:
The invention applies local quality by creating a narrow third region between the first and second bonding portions where the wire does not bond, while maintaining larger first and second bonding regions. This localized structural variation reduces the exposed area of the electrode pad, thereby improving resin adhesion in critical areas while preserving adequate bonding area for wire attachment.
Solution Approach 2:
The bonding surface is segmented into three distinct regions: a first bonding portion, a narrow third region, and a second bonding portion. This segmentation allows different areas to serve different functions - the first and second portions for wire bonding and the third region for reducing exposed area and improving resin adhesion, thus resolving the contradiction between bonding ease and adhesion reliability.
2Strength
If the wire is bonded to multiple positions on the electrode pad, then the bonding strength between wire and electrode pad is improved, but the exposed area between bonding positions increases causing resin peeling
Solution Approach 1:
By creating a narrow third region with specific dimensional constraints between the bonding portions, the invention locally modifies the structure to reduce exposed area where resin peeling occurs, while maintaining sufficient first and second bonding regions for strong wire attachment.
Solution Approach 2:
Instead of increasing the exposed area between bonding portions to facilitate wire bonding, the invention inverts the approach by minimizing the exposed area through the narrow third region configuration, thus improving resin adhesion while maintaining wire bonding strength through adequate first and second bonding regions.
3Reliability
If the exposed area of the electrode pad is reduced, then the resin sealer adhesion is improved, but the wire bonding area is limited
Solution Approach 1:
The electrode pad bonding surface is segmented into multiple functional regions: first bonding portion for wire attachment, narrow third region for reducing exposed area, and second bonding portion for additional wire bonding. This segmentation enables simultaneous achievement of strong wire bonding and improved resin adhesion.
Solution Approach 2:
The narrow third region is locally configured between the first and second bonding portions to specifically address resin adhesion concerns, while the first and second bonding regions maintain sufficient area for strong wire bonding, thus resolving the contradiction between reducing exposed area and maintaining bonding strength.
Data Source
AI summary
A performance of a semiconductor device is improved. The semiconductor device according to one embodiment includes a wire bonded to one bonding surface at a plurality of parts in an opening formed in an insulating film of a semiconductor chip. The semiconductor device includes also a sealer that seals the semiconductor chip and the wire so that the sealer is in contact with the bonding surface. The bonding surface includes a first region to which a bonding portion of the wire is bonded, a second region to which another bonding portion of the wire is bonded, and a third region between the first region and the second region. A width of the third region is smaller than a width of the first region and a width of the second region.