Semiconductor Wire Connection Detection via Transformer Coupling
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Solution Overview
Problem
In semiconductor devices with multiple chips connected by bonding wires, it is challenging to inspect the connection state of the wires after assembly without increasing parasitic capacitance, which is exacerbated by the need for high sensitivity in detecting wire disconnections.
Innovation Solution
A semiconductor device configuration that includes a first integrated circuit with a transformer and a second integrated circuit connected to the transformer, featuring a detector circuit that uses a comparator or inverter to detect the connection state of the wires by comparing potentials, thereby avoiding increased parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the current passing through the detector circuit is increased to detect the connection state around the bonding with good sensitivity, then the detection sensitivity is improved, but the parasitic capacitance is increased and the circuit does not conform to the originally required circuit specifications
Solution Approach 1:
The patent replaces the conventional current-based detection method with a transformer-based electromagnetic coupling method. The detector circuit uses a secondary coil that magnetically couples with the primary coil carrying the detection signal, enabling voltage detection through electromagnetic induction rather than direct current measurement. This substitution eliminates the need to pass large currents through the detector circuit, thereby avoiding increased parasitic capacitance while maintaining high detection sensitivity for wire bonding connections.
2Reliability
If a circuit through which a large current can be passed is configured to detect wire disconnection with good sensitivity, then the detection capability is improved, but the circuit complexity and parasitic effects increase
Solution Approach 1:
The patent introduces a transformer as an intermediary device between the detection signal source and the detector circuit. The primary coil receives the detection signal and generates a magnetically coupled voltage in the secondary coil, which is then detected by the detector circuit. This intermediary transformation allows the detection function to be achieved without directly passing large currents through the detector, simplifying the circuit design while improving wire connection detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective inspection of wire connections without increasing parasitic capacitance, enhancing detection sensitivity for wire disconnections while maintaining circuit specifications.
Implementation Method 1
a transformer including a primary coil and a secondary coil
Implementation Method 2
On basis of a potential at a predetermined reference point of the first power supply line, the detector circuit detects whether a connection state between the second integrated circuit and the secondary coil is normal or abnormal
Data Source
AI summary
A disconnection detector circuit that can favorably inspect a connection state of a wire without increase in parasitic capacitance is provided. A semiconductor device includes, in one package, a first integrated circuit including a transformer including a primary coil and a secondary coil, and a second integrated circuit connected to a midpoint and one end of the secondary coil. The second integrated circuit includes a reference line and a detector circuit. The reference line connects the midpoint of the secondary coil and a reference potential. On basis of a potential at a predetermined reference point of the first power supply line, the detector circuit detects whether a connection state between the second integrated circuit and the secondary coil is normal or abnormal.


