Semiconductor Wiring Layout for BGA Stress Relief
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Solution Overview
Problem
Wiring breakage occurs in semiconductor devices with BGA packages due to stress concentration in regions near support balls, leading to malfunction during temperature cycles.
Innovation Solution
The solution involves forming no ordinary width wiring in specific regions near support balls and using wide wiring lines in stress concentration areas to prevent breakage, with the first region extending from the center of the support ball and the second region positioned on the contour of the electronic element chip, and employing wide wiring lines with a width of 200 μm or greater.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If support balls are disposed outside the chip contour region to support the package substrate, then mechanical strength is improved, but wiring breakage occurs in the vicinity of support balls due to stress concentration
Solution Approach 1:
The patent applies local quality by creating a wiring-free zone around support balls where ordinary width wiring is prohibited. This local modification allows the support balls to provide mechanical strength while preventing stress concentration from causing wiring breakage. The first region extends from the center of each support ball outward, and the second region is positioned on the contour of the electronic element chip, creating protected zones where wiring is excluded to prevent breakage while maintaining overall structural integrity.
2Adaptability or versatility
If wiring is formed in the vicinity of support balls to maintain electrical connectivity, then electrical functionality is improved, but wiring breakage occurs due to stress concentration during temperature cycles
Solution Approach 1:
The patent segments the package substrate surface into distinct regions: ordinary wiring regions and protected wiring-free zones around support balls. By dividing the substrate into these functional zones, the patent allows wiring to be formed in areas needing electrical connectivity while excluding wiring from stress-prone areas near support balls, thus maintaining electrical functionality without sacrificing reliability.
Solution Approach 2:
The patent introduces wide wiring lines as an intermediary solution in regions between the protected zones and chip contacts. These wide wiring lines serve as mediators that can accommodate stress without breaking, providing electrical connectivity while bridging the gap between the wiring-free protected zones and the chip contact regions.
3Device complexity
If ordinary width wiring is formed near support balls, then device complexity is reduced, but wiring breakage occurs leading to malfunction
Solution Approach 1:
The patent applies local quality by creating specific prohibited regions around support balls where ordinary width wiring is not formed. This localized modification to the wiring layout prevents breakage in critical areas without requiring complete redesign of the entire wiring system, thus maintaining reasonable device complexity while significantly improving reliability.
Data Source
AI summary
An electronic component such as a semiconductor device is provided which is capable of preventing wiring breakage in a stress concentration region of surface layer wiring lines. In a semiconductor device provided with a support ball (5), no ordinary wiring line is formed in a region (7(A)) in the vicinity of the support ball (5) and a region (7(B)) at the end of the semiconductor chip facing the support ball (5), which are the stress concentration regions of the package substrate (2). Instead, a wiring line (6(C)) is formed away from these regions or a wide wiring line is formed in these regions.