Semiconductor Wiring Structure With Cavity-Filled Insulation
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Solution Overview
Problem
Void formation in insulating layers of semiconductor packages can lead to defects such as electrical short circuits due to expansion and exposure of voids during the curing process, affecting the integrity of the wiring structure.
Innovation Solution
A wiring structure with multiple insulating layers, including a first insulating layer that fills cavities in wiring patterns and a second insulating layer that covers the first, preventing void formation by ensuring complete filling and coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a wiring pattern with a cavity is formed in a wiring structure, then impedance characteristics can be evaluated, but voids may form in the insulating layer during curing, causing abnormal formation of upper wiring layers or electrical short circuits
Solution Approach 1:
The cavity is pre-formed in the wiring pattern before the insulating layer is applied. This preliminary action allows the insulating layer to completely fill the cavity during the subsequent coating process, preventing void formation while maintaining the cavity's functionality for impedance evaluation.
Solution Approach 2:
The insulating layer acts as an intermediary substance that fills the cavity in the wiring pattern. By properly filling the cavity with the insulating layer before curing, the harmful effect of void formation is eliminated, while the cavity structure remains intact for its intended measurement function.
2Difficulty of detecting and measuring
If the insulating layer is opened to expose the void, then the void can be detected, but plating material may flow into the cavity, causing electrical short circuit between wiring layers
Solution Approach 1:
The insulating layer is completely filled in the cavity before any opening or detection processes. This preliminary filling action ensures that even if the insulating layer is later opened for void detection, the cavity remains filled with insulating material, preventing plating material from flowing in and causing short circuits.
Solution Approach 2:
The cavity is pre-filled with the insulating layer to cushion against the potential harmful effect of plating material intrusion. This beforehand cushioning ensures that even under adverse conditions (such as opening the insulating layer for detection), the electrical integrity is maintained.
3Ease of manufacture
If a single insulating layer is used, then the manufacturing process is simpler, but voids may form and expand during curing, causing defects in the wiring structure
Solution Approach 1:
The insulating structure is segmented into multiple layers: a first insulating layer that fills the cavity in the wiring pattern, and a second insulating layer that covers the first. This segmentation ensures complete filling of the cavity while maintaining manufacturing feasibility, preventing void formation without excessive complexity.
Solution Approach 2:
The solution transitions from a single-layer insulating structure to a multi-layer insulating structure. By adding the vertical dimension of layering, the patent achieves complete cavity filling and void prevention while maintaining practical manufacturability through systematic layer construction.
Data Source
AI summary
A wiring structure includes: a plurality of wiring layers and a plurality of insulating layers. The plurality of wiring layers include a first wiring layer that include a wiring pattern and a cavity, and the plurality of insulating layers include a first insulating layer that fills the cavity, and a second insulating layer that contacts each of the first wiring layer and the first insulating layer and covers the first wiring layer and the first insulating layer.