Semiconductor Module Wiring Layout for Compact Heat Isolation
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Solution Overview
Problem
Existing semiconductor modules face an issue of increasing in size due to the increased number and mounting area of metal wiring boards, which can lead to heat generated by semiconductor devices being transferred to main terminals.
Innovation Solution
The semiconductor module incorporates a laminate substrate with first and second circuit boards on an insulating plate, featuring metal wiring boards with bonding, coupling, and raised sections that connect semiconductor devices to main terminals, reducing the need for additional wiring and minimizing the mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple metal wiring boards are used to connect semiconductor devices and main terminals, then electrical connection is achieved, but the mounting area increases and the module size increases
Solution Approach 1:
The patent combines multiple metal wiring boards into a single integrated metal wiring board structure that performs multiple functions: connecting semiconductor devices to circuit boards, providing heat dissipation pathways, and electrically connecting to main terminals. This merging eliminates the need for separate wiring boards for each function, reducing the overall mounting area while maintaining reliable electrical connections.
Solution Approach 2:
The metal wiring board is designed as a multi-functional component that simultaneously serves as an electrical connector, heat dissipation path, and structural support element. By making the wiring board universal in its functions, the patent eliminates the need for additional specialized components, thereby reducing the mounting area without compromising connection reliability.
2Reliability
If multiple metal wiring boards are used to connect semiconductor devices and main terminals, then electrical connection is achieved, but the module size increases
Solution Approach 1:
The patent merges multiple separate metal wiring boards into a single integrated structure that performs multiple functions: connecting semiconductor devices to circuit boards, providing heat dissipation pathways, and electrically connecting to main terminals. This merging eliminates the need for separate wiring boards for each function, reducing the overall mounting area while maintaining reliable electrical connections.
Solution Approach 2:
The metal wiring board is designed as a multi-functional component that simultaneously serves as an electrical connector, heat dissipation path, and structural support element. By making the wiring board universal in its functions, the patent eliminates the need for additional specialized components, thereby reducing the mounting area without compromising connection reliability.
3Temperature
If metal wiring boards are used to connect semiconductor devices and substrates, then heat dissipation is achieved, but the mounting area increases
Solution Approach 1:
The patent combines multiple metal wiring boards into a single integrated metal wiring board structure that performs multiple functions: connecting semiconductor devices to circuit boards, providing heat dissipation pathways, and electrically connecting to main terminals. This merging eliminates the need for separate wiring boards for each function, reducing the overall mounting area while maintaining effective heat dissipation.
Solution Approach 2:
The metal wiring board is designed as a multi-functional component that simultaneously serves as an electrical connector, heat dissipation path, and structural support element. By making the wiring board universal in its functions, the patent eliminates the need for additional specialized components, thereby reducing the mounting area without compromising heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents the semiconductor module from increasing in size while effectively dissipating heat generated by semiconductor devices, thereby preventing heat transfer to main terminals.
Implementation Method 1
a semiconductor device and a main terminal (external terminal) are connected to each other via a substrate to dissipate heat to be generated by the semiconductor device from a substrate
Data Source
AI summary
A semiconductor module includes a laminate substrate including an insulating plate and first and second circuit boards on an upper surface of the insulating plate, the first semiconductor device on an upper surface of the first circuit board, a first main terminal, and a first metal wiring board that electrically connects the first semiconductor device to the first main terminal. The first metal wiring board has a first bonding section bonded to an upper surface electrode of the first semiconductor device, a second bonding section bonded to an upper surface of the second circuit board, a first coupling section that couples the first bonding section to the second bonding section, a first raised section that rises upward from an end portion of the second bonding section. The first raised section has an upper end that is electrically connected to the first main terminal.