Semiconductor Wiring Height Alignment to Reduce Manufacturing Steps
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Solution Overview
Problem
The increased number of manufacturing steps and costs associated with semiconductor devices due to detouring wiring around other structures on the substrate.
Innovation Solution
A semiconductor device design that includes a substrate with first and second semiconductor layers, plugs, and connection wiring where the connection wiring is formed at the same height as the plugs, allowing for simultaneous formation with contact plugs to reduce manufacturing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring is made to detour around other structures on the substrate, then the wiring can avoid interference with existing structures, but the number of manufacturing steps increases
Solution Approach 1:
The patent merges the formation of connection wiring with the formation of contact plugs by making them the same structure formed at the same time. This integration eliminates the need for separate manufacturing steps for connection wiring, thereby reducing the total number of manufacturing steps while maintaining the ability to route connections around existing structures.
Solution Approach 2:
The connection wiring is designed to serve multiple functions: it acts as both a connection element and a routing structure that can detour around other structures. By making the connection wiring universal in its functionality, the patent eliminates the need for separate dedicated routing structures, thereby simplifying the manufacturing process.
2Reliability
If connection wiring is formed separately from contact plugs, then wiring connections can be established, but manufacturing costs increase due to additional steps
Solution Approach 1:
The patent combines the formation of connection wiring and contact plugs into a single manufacturing step. The same etching and filling processes used to create contact plugs are also used to create connection wirings, thereby eliminating additional manufacturing steps and reducing costs while ensuring reliable electrical connections.
Solution Approach 2:
The manufacturing process for contact plugs automatically creates connection wirings as well. The etching pattern and filling process that defines contact plug locations also defines connection wiring paths, allowing the process to serve itself by producing both structures simultaneously without requiring separate dedicated processes.
Data Source
AI summary
A semiconductor device includes a substrate and a first semiconductor layer and a second semiconductor layer each extending in a first direction perpendicular to a surface of the substrate. Furthermore, the semiconductor device includes a first plug provided on the first semiconductor layer and a second plug provided on the second semiconductor layers, and a connection wiring having an upper surface that is at a same height along the first direction as upper surfaces of the first and second plugs, and having a lower surface that is at a same height along the first direction as lower surfaces of the first and second plugs. Furthermore, the semiconductor device includes a first wiring provided on the first plug and the connection wiring and a second wiring provided on the second plug and the connection wiring.