Semiconductor Wiring Impedance Filter for High-Frequency Noise
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Solution Overview
Problem
Current semiconductor devices face challenges in reducing high-frequency noise while improving signal transmission characteristics, especially at high frequencies like 56 Gbps, where existing techniques are insufficient in maintaining signal quality and noise tolerance.
Innovation Solution
The semiconductor device incorporates a configuration with a low impedance delay portion and a high impedance delay portion, where the width and length of the wiring are strategically adjusted to create a band-limiting filter effect, shifting the characteristic impedance and adjusting phases to minimize reflection loss and effectively filter out high-frequency noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal transmission characteristics are improved by adjusting wiring configuration, then signal quality is enhanced, but high-frequency noise is also taken into the semiconductor device
Solution Approach 1:
The patent changes the physical parameters of the wiring structure by varying the width of wirings at different locations (wider first wiring, narrower second wiring) to create impedance variations that form a band-limiting filter. This parameter change allows the structure to pass desired signal frequencies while blocking high-frequency noise, resolving the contradiction between improving signal transmission and reducing noise entry.
Solution Approach 2:
The patent applies different wiring widths at different locations within the semiconductor device. The first wiring connected to the pad has a greater width than the second wiring, creating localized impedance changes. This local quality variation forms a band-limiting filter structure that selectively passes signals while blocking high-frequency noise, thereby resolving the contradiction between signal transmission improvement and noise reduction.
2Reliability
If additional filters are added to reduce high-frequency noise, then noise immunity is improved, but device complexity and cost increase
Solution Approach 1:
The patent makes the wiring structure serve multiple functions: it provides signal transmission pathways while simultaneously acting as a band-limiting filter to block high-frequency noise. By integrating the filtering function into the existing wiring structure rather than adding separate filter components, the patent improves noise immunity without increasing device complexity or requiring additional filters.
Solution Approach 2:
The patent merges the signal transmission function and the noise filtering function into a single integrated wiring structure. The same wirings that carry signals also provide the band-limiting filter effect through their varied width configuration. This merging eliminates the need for separate additional filters, thereby improving noise immunity while maintaining simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces high-frequency noise while maintaining or improving signal transmission characteristics, enhancing noise immunity and reducing system costs by effectively filtering out high-frequency noise without the need for additional filters.
Implementation Method 1
shifting the characteristic impedance and adjusting phases to minimize reflection loss
Implementation Method 2
create a band-limiting filter effect, shifting the characteristic impedance and adjusting phases to minimize reflection loss and effectively filter out high-frequency noise
Data Source
AI summary
The semiconductor device includes a solder ball connected to a pad, and located below the pad, a first wiring electrically connected to the pad, and located above the pad, and a second wiring electrically connected to the first wiring. At this time, a width of the first wiring is greater than a width of the second wiring. Accordingly, high-frequency noise can be reduced while improving signal transmission characteristics.