Semiconductor Wiring Substrate With Overlapping Signal Paths
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Solution Overview
Problem
Current semiconductor devices face challenges in densifying signal transmission paths without increasing the number of wiring layers, which complicates manufacturing and can lead to reduced product reliability.
Innovation Solution
The semiconductor device incorporates a wiring substrate with a pad forming layer and a first wiring layer, where signal pads overlap with wirings, and via lands have a larger width than the wirings, allowing for more efficient signal transmission with a reduced number of wiring layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of wiring layers is increased to densify signal transmission paths, then signal transmission capacity is improved, but manufacturing complexity increases and product reliability decreases
Solution Approach 1:
The patent transitions from planar wiring arrangement to three-dimensional overlapping arrangement. Specifically, the first wiring in the first wiring layer overlaps with the second wiring in the first wiring layer in the planar direction, enabling signal paths to be densified without adding wiring layers. This dimensional change in wiring arrangement resolves the contradiction by achieving higher transmission capacity while maintaining simple manufacturing processes.
2Productivity
If the number of wiring layers is increased to densify signal transmission paths, then signal transmission capacity is improved, but product reliability decreases
Solution Approach 1:
The patent uses planar overlapping of wirings in the first wiring layer to achieve signal path densification without increasing the number of wiring layers. This approach maintains product reliability by avoiding the complications associated with multiple wiring layers, such as increased via connections and manufacturing variability, while still achieving higher signal transmission capacity through efficient space utilization.
Solution Approach 2:
The patent merges the functions of multiple wiring layers into a single wiring layer by utilizing overlapping wiring patterns. The first wiring and second wiring overlap in the planar direction, allowing both to coexist in the same layer without interference, thereby achieving the signal transmission capacity of multiple layers while maintaining the reliability benefits of a single layer structure.
3Measurement precision
If via land width is increased to improve signal transmission, then signal quality is improved, but space for other wirings is reduced
Solution Approach 1:
The patent applies local quality by making the via land width selectively larger than the first wiring width only in specific regions where needed for signal quality, while maintaining compact wiring layouts elsewhere. The first via land overlapping with the first pad has a width larger than the first wiring in the second direction, ensuring good signal transmission through the via connection without unnecessarily consuming space across the entire wiring layer.
Solution Approach 2:
The patent resolves the space conflict by arranging wirings in overlapping positions in the planar direction rather than adjacent positions. The second wiring overlaps with the first pad while the first wiring connects to the first via land, allowing both wirings to share the same general area without interfering with each other's functionality, thus maintaining signal quality while maximizing space utilization.
Data Source
AI summary
A semiconductor device includes a wiring substrate provided with a plurality of pads electrically connected to a semiconductor chip in a flip-chip interconnection. The wiring substrate includes a pad forming layer in which a signal pad configured to receive transmission of a first signal and a second pad configured to receive transmission of a second signal different from the first signal are formed and a first wiring layer located at a position closest to the pad forming layer. In the wiring layer, a via land overlapping with the signal pad, a wiring connected to the via land, and a wiring connected to the second pad and extending in an X direction are formed. In a Y direction intersecting the X direction, a width of the via land is larger than a width of the wiring. A wiring is adjacent to the via land and overlaps with the signal pad.