Semiconductor Wiring Layout for Stable Wire Separation
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Solution Overview
Problem
The challenge of maintaining stable separation between closely spaced wires in semiconductor devices, which arises from the trend of down-scaling, affects device performance and reliability.
Innovation Solution
The semiconductor device incorporates specific wiring configurations, including connection vias and protruding portions aligned in certain directions, and employs interlayer insulating films with low-k materials to reduce coupling and enhance separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance between wires is continuously decreased to achieve high integration density, then the integration density is improved, but the stability of wire separation deteriorates
Solution Approach 1:
The wire structure is segmented into multiple portions (first line portion, second line portion, first protruding portion, second protruding portion) with specific geometric configurations. This segmentation allows each portion to serve distinct functions in maintaining separation while achieving high integration density.
Solution Approach 2:
Different portions of the wire structure have different local geometries and properties. The protruding portions extend in specific directions to create localized separation zones, while the line portions provide continuous connectivity. This local quality variation enables stable separation at critical points while maintaining overall wire functionality.
2Productivity
If the distance between wires is continuously decreased, then the integration density is improved, but the coupling between wires increases
Solution Approach 1:
The second line portion and first protruding portion act as intermediary structures between adjacent wires. These portions are aligned in the second direction and create physical separation zones that reduce capacitive coupling while allowing the wires to remain closely spaced for high integration density.
3Reliability
If complex wiring configurations with multiple portions and protrusions are implemented, then wire separation stability is improved, but the manufacturing complexity increases
Solution Approach 1:
The wire structure employs asymmetric geometry with protruding portions extending in specific directions (second direction) from the main line portions (first direction). This asymmetric design provides directional separation control, stabilizing wire separation while maintaining manufacturability through clear geometric definitions.
Data Source
AI summary
A semiconductor device includes: a first and second connection wirings in a first interlayer insulating film; a second interlayer insulating film on the first interlayer insulating film; a third connection wiring in the second interlayer insulating film; a first connection via connecting the third connection wiring and the first connection wiring; and a second connection via connecting the third connection wiring and the second connection wiring, wherein the third connection wiring includes (i) a first line portion extending in a first direction and comprising a first sidewall and a second sidewall opposite to the first sidewall in a second direction, (ii) a second line portion protruding from the first sidewall of the first line portion in the second direction, and (iii) a first protruding portion protruding from the second sidewall of the first line portion in the second direction.